Henkel Unveils Ultra-Low Viscosity Technomelt PA 6370 for Rugged Electronics Protection and Accelerated Manufacturing

Henkel Germany

Overview

Henkel has launched Technomelt PA 6370, an ultra-low melt viscosity hot melt material designed for robust protection of challenging electronic device designs. This new polyamide-based material offers a high-speed, cost-effective alternative to traditional potting processes in low-pressure molding. Technomelt PA 6370 effectively fills gaps as small as 0.5mm, providing excellent adhesion stability across multiple substrates and long-term environmental resistance, suitable for low-voltage applications like motors, connectors, sensors, and PCBs.

In Depth

Background and Challenges in Electronics Protection

Modern electronic devices are becoming increasingly miniaturized and densified, while simultaneously being deployed in ever-harsher environments across automotive, industrial, and consumer electronics sectors. Protecting vulnerable electronic components and PCBs from water, moisture, dust, vibration, shock, and temperature fluctuations is paramount for ensuring product reliability and longevity. While traditional potting and encapsulation technologies are effective, they often entail lengthy processing times, high production costs, and difficulties in filling complex geometries or micro-gaps.

Technical Innovation of Technomelt PA 6370

Henkel’s new Technomelt PA 6370 is an ultra-low viscosity hot melt material developed to address these challenges. Expanding the Technomelt low-pressure molding material portfolio, this polyamide-based hot melt offers key features and benefits:

• Ultra-Low Melt Viscosity: Its exceptionally low viscosity in the molten state allows for rapid and uniform filling of extremely small gaps, as tight as 0.5mm, and complex component geometries. This enables the protection of high-density electronic assemblies where potting proved challenging.
• High-Speed, Cost-Effective Process: When combined with low-pressure molding processes, it significantly reduces cycle times and manufacturing costs compared to conventional potting. Rapid solidification upon cooling boosts production throughput.
• Robust Protective Performance: Provides excellent resistance to moisture, heat, corrosion, and environmental factors. It also boasts superior electrical insulation properties and meets UL 94 V-0 flame retardancy standards, enhancing product safety and reliability.
• High Adhesion Stability: Demonstrates excellent adhesion stability to diverse substrates (e.g., metals, plastics), ensuring reliable, long-term protection.

Market Impact and Future Outlook

The introduction of Technomelt PA 6370 has the potential to significantly transform the electronics manufacturing industry. It offers a faster and more reliable protection solution particularly for low-voltage applications such as motors, connectors, sensors, and printed circuit boards. This material is expected to be widely adopted in fields requiring high robustness, including automotive electronics, industrial control systems, and IoT devices. Through this innovative material, Henkel aims to help customers efficiently manufacture smaller, higher-performing, and more reliable electronic devices, further solidifying its leadership in electronics protection technology. Combined with low-pressure molding, it unlocks new possibilities in the design and manufacturing of complex electronic components.