June 2026– date –
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3M VHB 4920 Acrylic Foam Tape Delivers High-Strength Bonding for AI Servers and EV Transport Systems
Yousan New Materials USA Overview 3M has introduced its VHB 4920 Acrylic Foam Tape, offering a high-strength, invisible bonding solution as an alternative to traditional mechanical fasteners. This versatile tape provides excellent enviro... -
Resonac Secures Key Patent on Liquid Encapsulant for 2.5D AI Chips, Bolstering Reliability and Market Position
IBTimes JP Japan Overview Resonac announced that the Japan Patent Office has upheld the validity of its patent (Patent No. 7687499) for a liquid encapsulant used in 2.5D semiconductor packages for generative AI. This ruling validates the... -
U.S. Thermal Interface Materials Market to See Substantial Growth by 2033, Driven by EV Battery Pack Gap Filler Adoption
Marks Park Solutions USA Overview This article provides an overview of a market research report published by Marks Park Solutions. The U.S. thermal interface materials (TIM) market is projected for significant growth by 2033, primarily f... -
Bostik’s Kizen® Miles 9.0 Wins INDEX™ 26 Award for Breakthrough Recyclable Hygiene Adhesive with 75% Renewable Content
Adhesives & Sealants Industry Magazine France Overview Bostik's Kizen® Miles 9.0, a groundbreaking recyclable hygiene adhesive, has been honored with an INDEX™ 26 Award for its innovative design. This adhesive facilitates controlled comp... -
Adhesives Drive Automotive Lightweighting: Critical for Battery Packs and Multi-Material BIW
Industrial publication/analysis (specific name not in snippet) Unknown Overview Adhesives are becoming increasingly critical for automotive lightweighting, particularly in EV battery packs and multi-material body-in-white (BIW) assemblie... -
Semiconductor Engineering Report Highlights AI-Driven Optical-Logic Integration and Hybrid Bonding for Increased Interconnect Density
Semiconductor Engineering USA Overview A June 2026 Semiconductor Engineering report emphasizes that AI systems are driving a closer integration of optics and logic, necessitating co-evolution in fabrication, packaging, thermal management... -
Henkel Showcases Sustainable Packaging Solutions at Interpack 2026, Featuring Low-CO₂ Hot Melts and Solvent-Free Laminating Adhesives
Henkel Germany Overview Henkel Adhesive Technologies will exhibit its portfolio of adhesives and coatings for sustainable packaging design at Interpack 2026. This includes low-CO₂ hot melts, solvent-free laminating adhesives (LOCTITE LIO... -
Sihl Launches Dual-Function Security Label Material, Enhancing Anti-Counterfeiting with Overt and Covert Features
Labels & Labeling Switzerland Overview Sihl launched a new dual-function security label material on June 11, 2026, designed to offer enhanced security features for various packaging and labeling applications. This product integrates both... -
BASF Unveils High-Performance PIB Binder Oppanol® N PLUS for Next-Gen EV Solid-State Batteries at Battery Show Europe 2026
SpecialChem Germany Overview BASF introduced Oppanol® N PLUS, a new high-performance polyisobutene (PIB) binder designed for next-generation EV batteries, particularly solid-state batteries, at The Battery Show Europe 2026. Characterized... -
Henkel’s Loctite EA 9497 Structural Adhesive Contributes to Sagrada Familia Central Towers Completion: 24 Tons Used for Accelerated, Durable Construction
Henkel Germany Overview Henkel announced that its advanced structural adhesive, Loctite EA 9497, played a crucial role in the modular construction of the Sagrada Familia's central towers. Over 24 tons of the adhesive were used to bond st...
