Henkel Unveils High-Performance Underfill Material for Advanced Logic and Memory Packaging, Boosting Production Efficiency

July 5, 2026

Advanced Packaging Journal Germany

Overview

Henkel has introduced a new high-performance underfill material designed for advanced logic and memory packaging technologies like flip-chip and chiplets. This material significantly improves device reliability and thermal cycling performance, while its low viscosity and rapid cure time enhance production efficiency. This advancement is crucial for meeting the demands of next-generation semiconductor manufacturing, reducing bottlenecks, and ensuring robust device operation.

In Depth

Key Findings

Henkel has announced a new high-performance underfill material engineered to address the demanding challenges of advanced logic and memory packaging. This innovative product is specifically designed to significantly enhance the reliability and thermal cycling performance of devices utilizing sophisticated packaging techniques such as flip-chip, fine-pitch, and chiplets. A key advantage is its combination of low viscosity and rapid cure time, which directly contributes to increased production throughput in semiconductor manufacturing processes.

Technical Details

Low Viscosity: Ensures excellent flowability into minute gaps, minimizing void formation, which is critical for complex, multi-layered advanced packages.
Fast Cure Time: Accelerates the production line’s cycle time, leading to reduced manufacturing costs. This is a vital factor in responding to the escalating demand for semiconductors.
Thermal Cycling Performance: Effectively mitigates stress caused by coefficient of thermal expansion (CTE) mismatches between dissimilar materials, guaranteeing long-term device reliability. This is particularly important for applications exposed to extreme temperature variations.
Versatility: Developed to meet the stringent requirements of next-generation high-performance semiconductor packaging, including chiplet integration and high-density interconnects.

Background & Context

The rapid evolution of AI semiconductors and high-performance computing (HPC) has led to increasingly complex and high-density semiconductor packaging. Specifically, chiplet technology, which integrates multiple dies into a single package, and fine-pitch flip-chip bonding, necessitate underfill materials with dramatically improved performance characteristics. Traditional underfills have struggled to meet the challenges of finer pitches and advanced thermal management, making the development of high-performance new materials an urgent priority for the industry.

Strategic Significance & Outlook

The introduction of this new underfill material is expected to further accelerate the adoption of advanced packaging technologies across the semiconductor industry. Through this material, Henkel aims to contribute to enhancing the production efficiency and reliability of next-generation processors and High Bandwidth Memory (HBM), thereby supporting performance improvements in diverse end products such as AI platforms, data centers, and mobile devices. Future expansion into a wider range of semiconductor applications is anticipated, solidifying Henkel’s position as a key enabler of advanced electronic architectures.

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