Dymax Launches 9310 Dual-Cure Adhesive for High-Reliability PCB Reinforcement, Streamlining Underfill Alternatives for Advanced Electronics and AI Hardware

August 2, 2026

PR Newswire USA

Overview

Dymax has launched its 9310 adhesive, an innovative light and secondary heat-cure solution engineered for reinforcing fine-pitch, leadless components on printed circuit boards in advanced electronics and AI hardware. This adhesive rapidly cures in seconds with light, with shadowed areas reliably cured by secondary heat, providing a streamlined alternative to traditional underfill. It ensures bond integrity through high-temperature reflow by offering high elongation and a controlled modulus, accommodating thermal and mechanical strain. This product enhances the performance and lifespan of critical electronic devices.

In Depth

Key Findings

Dymax has introduced its new 9310 adhesive, a dual-cure solution designed for high-reliability reinforcement of fine-pitch, leadless components on printed circuit boards (PCBs) in advanced electronics and AI hardware. This product offers an innovative and efficient alternative to traditional underfill processes, ensuring robust bond integrity under demanding thermal and mechanical conditions.

Technical Details

The Dymax 9310 adhesive’s core innovation lies in its dual-cure mechanism. It undergoes a rapid primary cure in seconds when exposed to UV or visible light, significantly boosting production throughput. For areas obscured from light, a secondary heat cure ensures complete and uniform cross-linking of the adhesive, enhancing overall reliability and performance. This combined approach overcomes the limitations often associated with traditional underfill materials, such as lengthy cure times and application constraints. The 9310 exhibits a high elongation (e.g., over X% elongation under specific conditions) coupled with a controlled modulus, enabling it to effectively absorb and dissipate stresses from thermal expansion/contraction cycles and external mechanical forces. This prevents cracking and delamination at the bond line, providing long-term protection for densely packaged PCB components, particularly critical for high-heat-generating devices like AI chips.

Background & Context

Modern electronic devices are characterized by rapid miniaturization, increasing density, and enhanced performance, leading to a proliferation of fine-pitch components on PCBs. In the AI hardware sector, the immense data processing capabilities generate significant heat, making effective thermal and mechanical stress management a critical challenge. Ensuring the reliability of component interconnections in such environments is paramount. Traditional underfill processes have often been bottlenecked by flow rates and extensive cure times, impacting production efficiency. The Dymax 9310 offers an efficient and reliable solution to these prevalent industry challenges.

Strategic Significance & Outlook

The introduction of Dymax 9310 provides a new, compelling option for high-density electronic packaging technology. This dual-cure adhesive is expected to see widespread adoption in applications requiring high reliability and performance, including AI servers, data centers, high-performance mobile devices, and autonomous driving systems. The simplification of manufacturing processes and reduction in cycle times offer substantial benefits to manufacturers, enhancing their market competitiveness. In the future, this technology will likely serve as a foundation for developing adhesives with properties tailored to even more diverse applications and for integration into fully automated adhesive dispensing processes within smart factories. Dymax 9310 is poised to become an increasingly vital material technology supporting the continuous evolution of electronic devices.

Source: https://www.prnewswire.com/apac/news-releases/dymax-launches-9310-adhesive-for-high-reliability-pcb-reinforcement-302839670.html

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