Ajinomoto Fine-Techno’s ABF Breakthrough Powers Next-Gen AI: Enhanced Dielectrics and Reduced CTE Critical for Advanced Packaging

August 23, 2026

Ajinomoto Fine-Techno Investor Relations Japan

Overview

Ajinomoto Fine-Techno has announced a significant evolution of its Ajinomoto Build-up Film (ABF) technology, specifically engineered to meet the rigorous packaging demands of next-generation AI semiconductors. The advancements include markedly improved dielectric properties and a reduced coefficient of thermal expansion (CTE), critical for larger substrate designs. These enhancements are pivotal for enabling high-density interconnects and superior thermal management in advanced AI processor packages, solidifying ABF’s essential role in the rapidly expanding AI market.

In Depth

Background

The explosive demand from generative AI and data centers is fueling unprecedented growth in the AI semiconductor market. To achieve their required high performance, AI chips increasingly rely on advanced packaging technologies such as 2.5D/3D packaging, chiplet integration, and High Bandwidth Memory (HBM). This reliance, in turn, necessitates higher-performance packaging materials like Ajinomoto Build-up Film (ABF). Ajinomoto Fine-Techno’s latest announcement represents a critical milestone in supporting the semiconductor technological innovation driving the AI era.

Key Findings

Ajinomoto Fine-Techno has achieved a groundbreaking evolution in its flagship Ajinomoto Build-up Film (ABF) technology, specifically engineered to address the sophisticated demands of next-generation AI semiconductor packages. This critical advancement endows ABF films with significantly improved dielectric properties and a substantially reduced coefficient of thermal expansion (CTE), thereby directly contributing to superior performance and enhanced reliability for the increasingly larger substrates required by advanced AI processors.

Technical Advancements

Improved Dielectric Properties: AI semiconductors necessitate materials exhibiting low dielectric loss and a low dielectric constant to facilitate high-speed signal processing and massive data transfer. The enhanced ABF film further optimizes these dielectric properties, critically minimizing signal degradation and enabling faster, more stable data transmission. This advancement is paramount for maximizing the computational throughput of AI chips.
Reduced Coefficient of Thermal Expansion (CTE): Larger AI processor packages are highly susceptible to CTE mismatch between the silicon die and the substrate, which can induce severe thermal stress, substrate warpage, and degrade connection reliability. The new ABF film’s significantly reduced CTE effectively mitigates stress generation during thermal cycling, thereby substantially improving the overall reliability and extended lifespan of the advanced package.
Support for High-Density Interconnects: The relentless drive for higher transistor counts in AI semiconductors mandates increasingly high-density wiring layers. The improved fine-patterning capabilities and exceptional dimensional stability of the advanced ABF film enable sub-micron level wiring, directly supporting the elevated integration density required by next-generation AI chips.
Optimized for Large Substrate Designs: As AI processor performance continues its rapid ascent, the physical dimensions of the substrates upon which these processors are mounted concomitantly expand. The enhanced ABF film is meticulously engineered to meet the stringent requirements of these large substrates, thereby accelerating its pivotal adoption in future AI infrastructure.

Strategic Significance & Outlook

This pivotal technological innovation in ABF film is poised to directly enhance the performance, facilitate miniaturization, and significantly improve the long-term reliability of AI processors, thereby substantially strengthening Ajinomoto Fine-Techno’s strategic position within the burgeoning AI market. The company pledges to continue its aggressive R&D efforts at the forefront of semiconductor packaging technology, consistently delivering high-functional materials that address the evolving and rigorous demands of data centers, edge AI, IoT devices, and other critical markets. This commitment ensures the continuous provision of essential foundational technology vital for a progressively digitized society.

Source: https://www.ajinomoto-fine-techno.com/ir/2026/abf-ai

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