DELO Introduces DUALBOND LT Series: Next-Gen Ultra-Low Temperature Curing Adhesives for Consumer Electronics, Curing at 45°C

August 23, 2026

SMT Today Germany

Overview

DELO has launched a new generation of super low temperature (SLT) curing adhesives, part of its DUALBOND LT family, specifically for consumer electronics assembly. These innovative adhesives achieve reliable bonding at temperatures as low as 45°C, or cure in just 10 minutes at 60°C, significantly accelerating production cycles. This advancement not only safeguards sensitive components from thermal damage but also broadens material compatibility, enabling novel assembly sequences and improved manufacturing flexibility.

In Depth

Key Findings

DELO has unveiled a new generation of super low temperature (SLT) curing adhesives, within its DUALBOND LT family, engineered for consumer electronics assembly. This innovation allows for robust bonding at temperatures as low as 45°C, drastically reducing curing times and enabling significant advancements in manufacturing efficiency and component protection.

Technical & Clinical Details

Product Series: The new SLT curing adhesives are part of DELO’s DUALBOND LT family.
Core Technical Advantages:
- Ultra-Low Temperature Curing: The adhesives can cure reliably at temperatures as low as 45°C. This capability makes them suitable for bonding heat-sensitive substrates and components that could not withstand traditional high-temperature curing processes.
- Rapid Curing: Achieving full cure in just 10 minutes at 60°C or one hour at 45°C, these adhesives offer substantial reductions in production cycle times compared to conventional adhesives, thereby improving throughput on assembly lines.
- Component Protection: The low curing temperatures minimize thermal stress on delicate electronic components such as sensors, camera modules, and flexible circuits, reducing the risk of heat-induced damage and enhancing overall product reliability.
- Expanded Material Compatibility: These adhesives demonstrate excellent adhesion to a wide range of plastics, metals, and composite materials, enabling the joining of diverse substrates and offering greater flexibility in product design.
Applications: Expected to be widely adopted in the assembly of consumer electronics like smartphones, tablets, and wearable devices.

Background and Industry Context

The trend towards miniaturization and higher performance in modern electronic devices has led to an increase in the number of precise, high-density, and heat-sensitive components. Traditional adhesive curing processes, often requiring high temperatures, posed challenges such as thermal damage to components, prolonged production times, and limitations on compatible materials. DELO’s SLT curing technology provides an innovative solution to these challenges, facilitating the manufacturing of more complex and high-performance electronic devices.

Outlook

The introduction of the DUALBOND LT series and similar ultra-low temperature, rapid-curing adhesives has the potential to transform electronic manufacturing paradigms. Production efficiency and product quality are both critical for manufacturers, and this technology offers a compelling solution. Future applications are anticipated to expand into broader industrial sectors, especially in precision instruments and medical devices where heat-sensitive materials are prevalent. DELO aims to drive innovation in manufacturing processes and sustainable product development through this advanced adhesive technology.

Source: https://smttoday.com/2026/08/18/less-heat-more-speed-delo-pushes-low-temperature-curing-further/

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