Lens Technology Enters Advanced Chip Packaging with Self-Developed Through-Glass Vias (TGV) Substrates and Dedicated 30,000sqm Factory

August 23, 2026

Chinadaily.com.cn China

Overview

Chinese smartphone glass screen manufacturer Lens Technology has announced its entry into the advanced chip packaging market, driven by AI chips pushing traditional material limits. The company showcased its self-developed Through-Glass Vias (TGV) substrates, specifically designed for advanced chip packaging. A dedicated 30,000-square-meter factory for TGV glass substrate production is currently under construction and slated to commence operations by year-end. This move signifies China’s strategy to bolster domestic capabilities in the critical back-end of the semiconductor supply chain and introduces a new player to the global glass substrate competition.

In Depth

Key Findings

Lens Technology, a leading Chinese manufacturer of glass screens for smartphones, has announced its significant entry into the advanced chip packaging market. This strategic move comes as the evolution of AI chips pushes the boundaries of traditional packaging materials. The company has publicly showcased its self-developed Through-Glass Vias (TGV) substrates, emphasizing their specific design for advanced chip packaging applications. Currently, a dedicated 30,000-square-meter factory for TGV glass substrate production is under construction, with operations expected to commence by the end of this year. This bold strategy symbolizes China’s broader effort to enhance its domestic production capabilities in the critical back-end segment of the semiconductor supply chain.

Technical Details

Through-Glass Vias (TGV) technology involves creating microscopic vias (holes) that vertically penetrate a glass substrate, enabling high-density electrical interconnections between chips and the substrate, or between chiplets. Compared to conventional organic substrates, glass substrates offer advantages such as a lower coefficient of thermal expansion, which helps to suppress warpage. Their superior surface flatness is also extremely beneficial for forming fine wiring patterns and precisely placing multiple chiplets in 2.5D/3D packaging. Lens Technology’s TGV substrates are believed to be designed to meet the high power density and bandwidth demands of AI chips, reducing signal attenuation and improving power efficiency. The 30,000-square-meter dedicated factory aims to establish mass production capabilities by equipping it with state-of-the-art facilities and a cleanroom environment suitable for the complex TGV manufacturing process.

Background & Context

The increasing performance of AI processors demands not only innovations in traditional semiconductor manufacturing but also significant advancements in packaging materials and processes. Especially for high-performance AI chips incorporating HBM (High-Bandwidth Memory), the thermal stability, dimensional stability, and electrical properties of the substrate are becoming bottlenecks. With major players like Intel, SKC, and Japan’s Shinko Electric Industries focusing on glass substrate development, Lens Technology’s entry signifies the addition of a prominent Chinese company to the global glass substrate race. The Chinese government prioritizes self-sufficiency and technological independence in the semiconductor supply chain, and advanced packaging is a critical pillar of this strategy. The company’s existing expertise in glass processing technology may prove advantageous in the development of TGV substrates.

Strategic Significance & Outlook

The commencement of TGV glass substrate production by Lens Technology will mark a significant development in China’s domestic AI chip supply chain. The factory’s operation by year-end will represent a major step forward for China in enhancing its capabilities in advanced packaging. In the future, this technology holds the potential for widespread adoption in AI data centers, edge AI, and high-performance mobile devices. However, challenges remain for the mass production of glass substrates, including stabilizing yields, ensuring cost competitiveness, and adhering to international technical standards. It will be crucial to observe whether Lens Technology can overcome these challenges and establish itself as a key player in the global advanced packaging market.

Source: https://global.chinadaily.com.cn/a/202608/15/WS6a7fb06da31073853ec53711.html

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