Key Findings: Taiwan’s MOEA Reveals 29 Advanced Semiconductor Technologies, Including Double-Sided RDL for CoPoS
Taiwan’s Ministry of Economic Affairs (MOEA) unveiled 29 groundbreaking technological innovations at the SEMICON Taiwan 2026 Technology Pavilion, covering advanced packaging, AI data center power management, and semiconductor testing and manufacturing equipment. These technologies are designed to address challenges in next-generation semiconductor manufacturing and reinforce global supply chains. Particular attention was drawn to the “Double-Sided RDL Key Process Integration Technology” tailored for CoPoS (Chip-on-Package-on-Substrate) applications.
Technical Details: Advancements in Double-Sided RDL and CoPoS Packaging
- Benefits of Double-Sided RDL Technology: This novel double-sided Re-Distribution Layer (RDL) process integration technology forms fine wiring layers on both sides of the package substrate, significantly enhancing the interconnect density between chips and the substrate. This enables more complex circuit designs, increases package design flexibility, and meets the demands of high-performance chips.
- Precision Alignment and Stacking: The technology allows for highly precise alignment and stacking of wiring layers, especially critical for multi-layer advanced package structures. This contributes to improved manufacturing yield and the mass production of reliable, high-performance chips.
- Application to CoPoS Packaging: CoPoS, when combined with chiplet and 3D stacking technologies, offers a packaging solution with extremely high integration and performance for AI and HPC applications. The technology presented by MOEA aims to further boost the performance and productivity of CoPoS packaging.
Background & Industry Context: Rising Strategic Importance of Semiconductor Back-End
With the advancements in AI, HPC, and 5G, semiconductor performance improvements can no longer solely rely on miniaturization. Advanced packaging technologies such as chiplet integration and 3D stacking – collectively known as “semiconductor back-end processes” – have become critical in determining overall chip performance, power efficiency, and cost. Taiwan’s MOEA recognizes this industry trend and is promoting investment and innovation in advanced packaging technologies as a national strategy.
Strategic Significance & Outlook: Contribution to Global Supply Chains and Market Competitiveness
These technological innovations announced by the MOEA are essential for Taiwan’s semiconductor industry to maintain its leading role in the global supply chain. Specifically, the double-sided RDL technology for CoPoS could be a significant breakthrough in the development and manufacturing of next-generation AI chips and data center semiconductors. This is expected to further strengthen Taiwan’s technological advantage in advanced packaging and enhance its competitiveness in the global semiconductor market.
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