2026– date –
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China Invests 40 Billion Yuan ($5.5 Billion) in New Advanced Packaging Projects for AI/HPC to Prepare for Next Chip Shortage
All-About-Industries China Overview China's advanced packaging industry is embarking on a new wave of capacity expansion to meet the escalating demand for AI and High-Performance Computing (HPC) chips. Between May and July 2026, approxim... -
Hanmi Semiconductor Leads HBM4 TC Bonder Market, Diversifies Client Base with Micron Deals to Reduce SK Hynix Dependency
digitimes Taiwan Overview Hanmi Semiconductor has gained a significant lead over competitor Hanwha Semitech in the crucial thermal compression (TC) bonder market for High Bandwidth Memory (HBM) manufacturing. This market advantage is dri... -
SK Hynix Pioneers Optical Interconnects Beyond HBM, Outlines Roadmap for AI Bandwidth Challenges
Adalytica South Korea Overview SK Hynix is charting a course for optical chip connections that extend beyond High Bandwidth Memory (HBM) to address critical bandwidth limitations in large-scale AI systems. A recent Nature Electronics rev... -
HBM4 Breaks Bottlenecks: Hybrid Bonding Delivers 20%+ Thermal Reduction, 40% Power Efficiency Boost, 2.0TB/s+ Bandwidth
SemiHub.io International Overview HBM4, the next-generation High Bandwidth Memory, is set to significantly advance AI/HPC performance by doubling its I/O width to 2048 bits, targeting over 2.0 TB/s bandwidth per stack and substantial pow... -
SK Hynix Secures HBM4 Future: 70% Price Surge, 2026 Capacity Sold Out, and $3.87B US Investment for Advanced Packaging Independence
Adalytica and others South Korea Overview SK Hynix has signaled its dominance in the High Bandwidth Memory (HBM) market by reportedly increasing HBM4 prices by 70% for its 2026 supply, which is already entirely presold. Concurrent with t... -
PitchBook Analysis: Rebounding Biotech Funding Expected to Drive CDMO Growth in 2026, Focus on Complex Modalities
BioSpace USA Overview This article provides an overview of a PitchBook analysis report. According to PitchBook, biotech venture capital funding in the first half of 2026 surpassed $10 billion, driven significantly by Isomorphic Labs' $2.... -
Biotech VC Funding Reaches $20.1 Billion in H1 2026 as Companies Secure Significant Capital for Early Development Stages
BioBucks / Fierce Biotech USA Overview In the first half of 2026, biotech VC funding totaled $20.1 billion, with several companies completing major financing rounds. Vaderis Therapeutics secured $152 million in Series B for a Phase III t... -
K-38 Consulting Report: Biotech VC Funding Rebounds to Over $9.1 Billion in H1 2026, While Early-Stage Investment Hits Pre-Pandemic Low
WBOC (Press Release) USA Overview This article presents an overview of a market research report by K-38 Consulting. The report indicates that biotech venture capital funding in the first half of 2026 exceeded $9.1 billion, reaching its h... -
DCAT Report: 2026 CDMO Market Sees Major M&A and Capital Investments, with Samsung Biologics to Acquire PolyPeptide Group for $1.8 Billion
DCAT Value Chain Insights USA Overview According to a DCAT Value Chain Insights report, the 2026 CDMO market is witnessing a surge in peptide-based drug development, accompanied by significant M&A and capital investments. Samsung Bio... -
Keymed Biosciences’ BCMA x CD3 Bispecific Antibody CM336 Advances to Phase II for Relapsed/Refractory Light Chain Amyloidosis, Secures $257M from Gilead’s Acquisition of Partner
BioSpace China Overview Keymed Biosciences announced its H1 2026 results and business updates, reporting that its BCMA x CD3 bispecific antibody, CM336, is progressing in a Phase II clinical trial for relapsed/refractory light chain amyl...
