2026– date –
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Intel OCI Chiplet: AI infrastructure power specs for 2026
Simple Tech Trend USA Overview At OFC 2026, Intel introduced its Optical Compute Interconnect (OCI) chiplet, deemed essential for AI scale-up infrastructure. This OCI chiplet demonstrates remarkable energy efficiency of approximately 5 p... -
Broadcom Bailly Switch: 51.2Tb CPO power reduction specs
Simple Tech Trend USA Overview Broadcom has commenced mass production of its 51.2 Terabit (Tb) Bailly switch, achieving up to 70% power consumption reduction through Co-Packaged Optics (CPO) compared to traditional pluggable transceivers... -
800ZR: OIF’s 2024 coherent implementation agreement specs
Digital Journal USA Overview The OIF announced its 800ZR Coherent Implementation Agreement in October 2024, highlighting the hidden complexities in the transition to 400G and 800G infrastructure driven by AI-led network upgrades. This ag... -
TFLN Modulators: Murata’s CPO roadmap for 2028 production
The Elec Japan Overview Murata Manufacturing has unveiled its Co-Packaged Optics (CPO) technology roadmap for AI data centers, centering on high-performance Thin-Film Lithium Niobate (TFLN) optical modulators. The company plans to comple... -
Frequency Combs: Optica’s 2026 AI optical I/O roadmap
Optica USA Overview Alexander Gaeta's article in Optica details groundbreaking advancements in commercializing frequency combs for integrated photonics. This technology allows for the generation of low-power, compact microcombs compatibl... -
Tomahawk 6: Fuji’s first SMT placement of Broadcom CPO
Davisson (Fuji Corporation Press Release) Japan Overview Fuji Corporation has successfully performed the industry's first SMT placement evaluation of Broadcom's Tomahawk® 6 – Davisson Co-Packaged Optics (CPO) Ethernet switch. Utilizing t... -
OFC 2026: Broadcom and Coherent photonic interconnect specs
Simple Tech Trend (OFC Panel Report) USA Overview An OFC 2026 panel highlighted the critical challenge of ultra-low-power photonic scale-up interconnects for AI clusters, showcasing diverse technological approaches. Broadcom demonstrated... -
PNNL U-Net model: Residual stress distribution for parts explained
PNNL (Pacific Northwest National Laboratory) (The International Journal of Advanced Manufacturing Technology) USA Overview Research from PNNL proposes a machine learning (ML) based Residual Stress Generator (RSG) to infer full-field resi... -
Molecular crystal prediction: 3-stage generative process specs
arXiv Unknown Overview A new three-stage generative process for molecular crystal structure prediction (MCSP) has been introduced, learning invariant lattice descriptors from molecular graphs, Hall settings, and the number of molecules i... -
Elements Claw AI: Alibaba DAMO Academy’s 4 new superconductors
Startup Fortune USA Overview Alibaba DAMO Academy, in collaboration with Renmin University and University of Chinese Academy of Sciences, announced that their AI agent 'Elements Claw' successfully screened 2.4 million candidate crystal s...
