2026– date –
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HBM Shortage Accelerates ‘Chipflation,’ TrendForce Forecasts New Normal Driven by Unabating AI Demand
The Korea Economic Daily South Korea Overview Surging AI infrastructure demand is driving up memory chip prices, straining cloud providers' profit margins. Market research firm TrendForce predicts that the HBM (High-Bandwidth Memory) sho... -
India’s Semiconductor Ecosystem Rapidly Expanding: Government Commits ₹1.275 Trillion for Semicon 2.0, First ATMP/OSAT Facility Operational
Asia Briefing India Overview India's semiconductor manufacturing ecosystem is rapidly expanding in 2026, with 13 approved semiconductor projects currently operational or under development, including the launch of the first ATMP/OSAT faci... -
South Korea’s JNTC and Japan’s TOPPAN Announce Partnership for AI Chip Glass Substrate Technology, Overcoming Organic Substrate Limits for Next-Gen Packaging
Tai (via Semiconductor News) South Korea Overview South Korea's JNTC and Japan's TOPPAN have forged a strategic partnership for next-generation glass substrate technology aimed at AI chips. As advanced packages integrating AI accelerator... -
Indian State of Madhya Pradesh Signs MoU for ₹6,200 Crore OSAT Facility with Paras Semiconductors, Advancing Heterogeneous Integration and 3D Packaging
ET Government India Overview The government of Madhya Pradesh, India, announced a Memorandum of Understanding with Paras Semiconductors to establish an advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly and Test) fa... -
Nvidia Secures $1.5 Billion Advanced Packaging Deal with Amkor, Diversifying Supply Chain and Easing TSMC CoWoS Bottlenecks
TradingKey USA Overview Nvidia and Amkor Technology have signed a multi-year packaging services agreement valued at approximately $1.5 billion. This pivotal deal is a strategic move for Nvidia to reduce its reliance on TSMC's CoWoS packa... -
Powertech Technology and Broadcom Establish $400 Million Singapore FOPLP Joint Venture for AI ASICs Manufacturing
DigiTimes Taiwan Overview Powertech Technology (PTI) has approved a $400 million investment in a joint venture with Broadcom in Singapore to build Fan-Out Panel-Level Packaging (FOPLP) manufacturing capacity. This strategic move aims to ... -
Samsung Delays Hybrid Bonding HBM Mass Production to 2029-2030, Aligning with Technical Challenges and NVIDIA’s Next-Gen GPUs
TrendForce South Korea Overview Samsung Electronics is reportedly delaying the full-scale mass production of its hybrid bonding technology for next-generation HBM and logic semiconductors until 2029-2030. The company is currently buildin... -
Besi Semiconductor Reports Doubled Quarterly Orders Driven by Soaring AI and Hybrid Bonding Demand, Expanding Customer Base
WHTC (Reuters) Netherlands Overview BE Semiconductor Industries (Besi) announced a more than twofold increase in quarterly orders year-over-year, driven by robust demand from AI, hybrid bonding, photonics, and data centers. The company's... -
Taiwan’s Grand Process Technology Partners with Germany’s Singulus to Enter Panel-Level Packaging (PLP) Market, Offering AI/HPC Solutions
Taiwan News Taiwan Overview Taiwan's Grand Process Technology Corp. announced its entry into the panel-level packaging (PLP) market through a strategic alliance with its subsidiary Challentech International Corp. and Germany's Singulus T... -
China’s HKC Invests 4 Billion RMB in New Advanced Semiconductor Packaging and Test Line in Shaoxing for Heterogeneous Integration
TrendForce China Overview China's HKC announced a 4 billion RMB ($550 million) investment in an advanced semiconductor packaging and test project in Shaoxing Economic Development Zone. A new subsidiary, Zhejiang Huaxin Advanced Semicondu...
