2026– date –
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L3Harris Delivers Upgraded RS-25 Engines with Modern Electronics for NASA’s Artemis III SLS Core Stage
L3Harris Technologies Press Release USA Overview L3Harris Technologies delivered four RS-25 engines for the NASA Space Launch System (SLS) core stage for the Artemis III mission. These engines feature upgraded modern electronics and new ... -
NASA Spaceline Reports China Space Station Microgravity Study Reveals Underestimation of Body Mass in Motion Control
NASA Spaceline Current Awareness List #1,208 USA Overview NASA Spaceline's latest update highlights a China Space Station study demonstrating that kinematic signatures in reaching movements during spaceflight provide evidence of humans u... -
MDPI Paper Introduces Compute-Density Metrics for AI Space Missions, Accelerating High-Performance AI on Small Satellites
Engineering Proceedings (MDPI) Switzerland Overview A study in MDPI's Engineering Proceedings proposes 'TOPS/kg' as a new compute-density metric to enable future AI missions in space. This metric provides crucial design criteria for depl... -
Hybrid Rocket Engine Advancements Detailed in MDPI Study, Enhancing Sustainable and Competitive Space Propulsion
Engineering Proceedings (MDPI) Switzerland Overview A study in MDPI's Engineering Proceedings details technological advancements in hybrid rocket engines for sustainable and competitive in-space propulsion. It highlights the potential of... -
Deep Delta Gated Networks Achieve High-Throughput Defect Detection in Space Manufacturing
IEEE SPace, Aerospace and defenCE Conference (SPACE 2026) Proceedings India Overview A new 'DDV-GNet' deep delta gated network presented at IEEE SPACE 2026 significantly enhances defect detection throughput and accuracy for in-space manu... -
NCF Evolves into Essential Material for AI Chips, HBM Stacking, and Advanced Packaging, Ensuring Stable Bonding and Enhanced Reliability
LP Information Data Global Overview Non-Conductive Film (NCF) has evolved from an auxiliary adhesive to an indispensable material in advanced packaging, driven by rapid advancements in AI servers, accelerated computing chips, High-Bandwi... -
Applied Materials Finds New Equipment Opportunities in PLP for AI Accelerators; KLA’s Process Control Gains Criticality for Complex AI Chips
TIKR.com USA Overview Applied Materials is capitalizing on new equipment opportunities within Panel-Level Packaging (PLP) as AI accelerators integrate more processors and memory, shifting from traditional circular wafers to rectangular p... -
Fraunhofer Unveils APECS Pilot Line: Accelerating Advanced Packaging and Heterogeneous Integration Under EU Chips Act
Fraunhofer-Institut für Angewandte Festkörperphysik IAF Germany Overview Under the EU Chips Act, Fraunhofer IAF has established APECS, a new pilot line for advanced packaging and heterogeneous integration, designed to bridge microelectro... -
SK hynix Unveils $4 Billion Indiana HBM Plant, Bolstering U.S. Semiconductor Packaging and AI Supply Chains
Silicon Analysts USA Overview SK hynix has announced a significant $4 billion investment to establish an advanced High-Bandwidth Memory (HBM) packaging facility in Indiana, USA, with mass production slated for late 2028. This strategic m... -
TYLsemi Raises $43M Seed Funding, De-Risking Chiplet-Based Designs with Full-Stack Platform for AI Infrastructure Builders
Tom's Hardware USA Overview Semiconductor startup TYLsemi secured $43 million in seed funding and unveiled a novel business model designed to de-risk chiplet-based designs for AI infrastructure builders. The company aims to accelerate ef...
