2026– date –
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TSMC’s CoWoS Packaging Capacity Identified as Bottleneck in Korea’s HBM4E Race, Despite SK hynix and Samsung Shipments
Aju Press South Korea Overview Despite SK hynix and Samsung Electronics commencing sample shipments of 12-layer HBM4E chips to major customers like Nvidia, TSMC's CoWoS advanced packaging capacity is highlighted as the true bottleneck in... -
Samsung Validates Hybrid Copper Bonding’s Superior Thermal Management for HBM4E, Outperforming TCB
ET News (via IEEE paper) South Korea Overview Samsung published research in IEEE demonstrating that its Hybrid Copper Bonding (HCB) offers significant thermal management advantages over conventional Thermo-Compression Bonding (TCB) for H... -
ATLANT 3D, A*STAR IMRE, and NAMIC Launch AI-Driven Materials Development Hub in Singapore
PR Newswire Singapore Overview ATLANT 3D, A*STAR IMRE, and NAMIC have signed an MoU to establish an Advanced Materials Development Hub (A-HUB) in Singapore, leveraging ATLANT 3D's Direct Atomic Layer Processing (DALP®) technology. This c... -
Malaysia Invests RM185 Million ($40M) in Advanced Semiconductor R&D Initiative, Targeting 7% Global Packaging Market Share with HBM4 Test Chip Development
Malay Mail / Digital News Asia Malaysia Overview Malaysia's Ministry of Science, Technology and Innovation (Mosti) has launched a RM185 million (approx. $40 million USD) Research, Development, Innovation, Commercialization, and Economy (... -
Morgan Stanley: TSMC AI Revenue to Triple by 2027, CoWoS Packaging Remains Critical Bottleneck
HTX Insights (Morgan Stanleyレポート引用) International Overview A new report from Morgan Stanley forecasts TSMC's AI-related revenue to surge by 218% to $86.3 billion by 2027, up from $27.1 billion in 2026. However, this explosive growt... -
ASE Technology Holding Raises 2026 Capex to $8.5 Billion Driven by Surging AI Advanced Packaging Demand, Launches 15 Expansion Projects in Taiwan & Malaysia
SemiMedia Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, has significantly increased its 2026 capital expenditure plan from $7 billion to $8.5 billion, a 21.4% jump, driven by robust demand from AI servers, HP... -
TSMC Boosts CoWoS Capacity, Reducing AI Chip Supply Gap to 10% by Late 2026; Next-Gen CoPoS Pilot Production for NVIDIA’s ‘Feynman’ Slated for 2027
Futuretech Components / Daily Beirut Taiwan Overview TSMC is rapidly expanding its CoWoS advanced packaging capacity to meet surging demand from AI accelerators and HPC applications, projected to narrow the supply-demand gap from 20% to ... -
Applied Materials Unveils New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc. USA Overview Applied Materials has introduced a suite of new material engineering systems designed to accelerate the manufacturing of advanced 3D chip architectures crucial for next-generation AI. These innovation... -
Ionis Forges $30M Ex-US Rare Disease Pact with Recordati, Accelerating Global ASO Reach
Fierce Biotech USA Overview Ionis Pharmaceuticals has secured a $30 million upfront payment from Recordati, granting the Italian firm exclusive ex-US development and commercialization rights for specific rare disease therapies. This stra... -
Boehringer Ingelheim Fuels Immunai’s AI with $15M to Unlock T-Cell Secrets for Cancer, Autoimmune Drug Discovery
Fierce Biotech USA Overview Boehringer Ingelheim (BI) has invested $15 million in Immunai's advanced AI platform, initiating a collaborative research agreement. This partnership aims to accelerate drug discovery for cancer and autoimmune...
