2026– date –
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Semiconductor Startup Funding Diversifies Beyond AI Accelerators to Interconnects and Packaging; TSMC CoWoS Capacity to Quadruple by EOY 2026
New Market Pitch Global Overview Semiconductor startups attracted $8.4 billion in Q1 2026, pushing cumulative funding to $10.7 billion, with investments diversifying beyond AI accelerators to interconnects, optical I/O, memory, and advan... -
Hanmi Semiconductor Secures ₩44.2 Billion SK hynix Order for HBM4 TC Bonders, Signaling Robust Advanced Packaging Equipment Market Growth
HTX South Korea Overview Hanmi Semiconductor has received a significant ₩44.2 billion (approx. $32 million) order from SK hynix for its TC Bonder 4.5 Griffin, crucial for next-generation HBM4 production, with delivery slated for early Se... -
ASML, TSMC, and Imec Achieve Breakthrough 300mm Integration for Industry-Ready 2D-Material Transistors
The cleanroom Portal - Reinraum Online Germany Overview Imec, in collaboration with ASML and TSMC, presented a robust and scalable 300mm integration approach for n- and p-FETs based on 2D materials at the IEEE/JSAP Symposium 2026. This b... -
Imec’s Chiplet Imperative: Analyzing the Transition to High-Bandwidth, Low-Energy AI/HPC Systems
imec ベルギー Overview Imec has published a comprehensive analysis identifying the economic and technical inflection points for transitioning from monolithic ASICs to chiplet-based designs, particularly for AI, HPC, and data center appli... -
Morgan Stanley Raises CoWoS Demand Forecast to 2.69 Million Wafers by 2027, Citing CPUs and ASICs as New Drivers
Industry Analysis / Moomoo Unknown Overview Morgan Stanley has significantly raised its demand forecast for TSMC's CoWoS packaging, projecting it to reach 2.69 million wafers annually by 2027. CPUs and ASICs are emerging as new key drive... -
Imec Unveils Vertically Stacked IGZO FeFETs, Revolutionizing AI Memory Density and Efficiency
IN Electronics & Design ベルギー Overview Imec has achieved a significant breakthrough in ferroelectric memory for AI systems, demonstrating a vertically stacked FeFET architecture utilizing IGZO and successfully reducing ferroelectric c... -
Imec Targets Optical Interconnect Packaging Bottlenecks for Next-Gen AI and HPC
ApplyKite (imec) ベルギー Overview Imec is seeking a PhD candidate for groundbreaking research into microfluidics and photonics packaging, crucial for optical interconnects in future AI and High-Performance Computing (HPC) systems. The p... -
Resonac to Initiate High-Purity HF Gas Production at Tokuyama Plant by 2026, Strengthening Domestic Semiconductor Supply
Resonac (Official Press Release) / IBTimes JP Japan Overview Resonac announced it will begin producing high-purity hydrogen fluoride (HF) gas for semiconductors at its Tokuyama plant in Shunan City, Yamaguchi Prefecture, within 2026. Thi... -
TSMC Accelerates CoPoS Packaging with Glass Core Substrates: Targets 30% Cost Reduction, >90% Wafer Utilization Post-2028
Wccftech / CHOSUNBIZ / BigGo Finance Taiwan Overview TSMC is accelerating the development of CoPoS packaging, a successor to CoWoS, leveraging glass core substrates co-developed with Ibiden and Innolux. This panel-level packaging approac... -
Samsung and SK Hynix Announce Major HBM Capacity Expansions: Samsung Allocates Half to HBM4, Targeting 250K Wafers/Month by EOY 2026
Industry News / ChosunBiz South Korea Overview Samsung Electronics announced plans to increase its HBM production capacity by approximately 50% from 2025 levels, aiming for 250,000 semiconductor wafers per month by the end of 2026. The c...
