Sumitomo Bakelite Unveils Novel Low-Stress Epoxy Compound for Next-Gen 2.5D/3D Packaging

August 23, 2026

SEMI Europe Conference News Japan

Overview

Sumitomo Bakelite has announced a groundbreaking epoxy molding compound (EMC) at SEMI Europe, specifically engineered for the intricate demands of 2.5D and 3D advanced packaging solutions. This material delivers superior flow characteristics and significantly reduced internal stress, crucial for protecting delicate chiplets and interposers in complex heterogeneous integration. The development addresses critical challenges in high-performance computing and AI, strengthening the foundation for future semiconductor manufacturing.

In Depth

Background

Driven by the surging global demand for artificial intelligence (AI) and high-performance computing (HPC), semiconductor devices are rapidly evolving. This evolution is characterized by a significant shift towards 2.5D and 3D advanced packaging, alongside heterogeneous integration utilizing chiplet architectures, all aimed at achieving unprecedented levels of performance and miniaturization. However, this technological paradigm shift introduces new and complex challenges that conventional packaging materials are increasingly struggling to address. Sumitomo Bakelite’s latest material innovation provides a cutting-edge solution to these emerging challenges, reinforcing the foundational technologies necessary for next-generation semiconductor manufacturing.

Key Findings

Sumitomo Bakelite garnered considerable attention at the recent SEMI Europe conference with the unveiling of its advanced epoxy molding compound (EMC), precisely engineered for the stringent requirements of 2.5D and 3D advanced packaging. This novel material is designed to significantly enhance reliability for delicate chiplets and interposers in the context of increasingly complex heterogeneous integration.

Key technical advantages of this new EMC include:

Superior Flow Characteristics: In the densely packed architectures of 2.5D/3D packaging, it is imperative for the EMC to fully and uniformly encapsulate the intricate structures of chiplets and interposers. Sumitomo Bakelite’s new EMC boasts exceptional flowability, enabling it to meticulously fill even the most complex internal package geometries. This minimizes the risk of void formation, a common defect source, and significantly improves overall manufacturing yield and reliability.
Low Stress Properties: Heterogeneous integration, involving the stacking and close integration of multiple chiplets with diverse material properties, inherently generates substantial thermo-mechanical stress, particularly during thermal cycling. Such stress can lead to critical failures like cracks and delamination at sensitive interfaces. This innovative material has been engineered to balance a low coefficient of thermal expansion (CTE) with superior stress relaxation capabilities. This delicate balance effectively minimizes stress exerted on chiplets and bond interfaces, thereby enhancing long-term device reliability and operational lifespan.
Enhanced Protection: Epoxy molding compounds are fundamental to safeguarding semiconductor devices from a myriad of external environmental threats, including physical shock, moisture ingress, chemical exposure, and thermal fluctuations. This new material provides robust and comprehensive protection against these environmental factors, substantially increasing the durability and operational reliability of advanced packaging devices throughout their lifecycle.

Strategic Significance & Outlook

This advanced EMC is poised for critical adoption across sectors where cutting-edge packaging technologies are indispensable, including AI accelerators, data center processors, and high-performance graphics processing units (GPUs). By providing this material solution, Sumitomo Bakelite aims to empower semiconductor manufacturers to overcome their most pressing technical challenges, thereby making a substantial contribution to the continued advancement of the digital society. The company has affirmed its commitment to ongoing research and development efforts, ensuring it remains responsive to the evolving and increasingly complex needs of the global semiconductor market.

Source: https://www.semieurope.org/news/2026/sumitomobakelite-emc

Get our weekly technology intelligence — free

Receive an infographic that lets you judge at a glance whether each field’s analysis report is worth reading.

Subscribe Free — Weekly Tech Intelligence

By subscribing, you’ll receive Troy-Technical’s weekly technology intelligence newsletter.