PI Advanced Materials has been honored with the 2026 KPCA Industry Award for its pioneering mass production technology of 4µm ultra-thin polyimide film, addressing the escalating demand for miniaturization and higher density in mobile devices, flexible displays, and semiconductor packaging. This achievement underscores the company’s leading capabilities in innovative material science and manufacturing.
Key Findings
- Developed the world’s first mass production technology for 4µm thick polyimide film.
- Achieved a thickness approximately one-third of traditional 12.5µm films.
- Maintained equivalent mechanical strength, thermal stability, and adhesive properties despite significant thinning.
- Enhanced reliability for flexible substrate applications, enabling higher-resolution circuit patterns.
Technical Details
The newly developed 4µm polyimide film is a testament to PI Advanced Materials’ extensive expertise in polyimide polymerization and precision coating technologies. By optimizing molecular chain alignment control and film thickness uniformity, the company has successfully achieved extreme thinness without compromising high dimensional stability and mechanical properties. This thinness is crucial for improving the reliability of flexible devices that require high bending endurance. Furthermore, the film ensures stability under high-temperature conditions, making it suitable for semiconductor manufacturing processes and high-power device applications.
Background & Context
The electronics industry is witnessing rapid advancements in device performance, multi-functionality, and miniaturization, demanding increasingly sophisticated materials. Flexible and highly reliable substrate materials are indispensable for emerging technologies such as foldable smartphones, wearable devices, and high-performance packaging for next-generation AI chips. Polyimide film, known for its superior heat resistance, mechanical strength, and electrical insulation, is widely used in flexible printed circuit boards (FPC) and chip-on-film (COF). PI Advanced Materials’ new technology directly addresses these evolving market needs, establishing a strong competitive advantage.
Strategic Significance & Outlook
This 4µm polyimide film technology is expected to contribute to further thinning and enhanced durability in flexible displays. Its applications extend to a broad range of sectors including 5G communication modules, IoT devices, and automotive electronics. The film’s ultra-thin profile facilitates overall product miniaturization and weight reduction, offering greater design flexibility. PI Advanced Materials plans to leverage this technology to continue delivering high-value-added advanced material solutions, supporting the advancement of the electronics industry. The KPCA Industry Award serves as strong validation of its technological leadership.
Get our weekly technology intelligence — free
Receive an infographic that lets you judge at a glance whether each field’s analysis report is worth reading.
Subscribe Free — Weekly Tech Intelligence
By subscribing, you’ll receive Troy-Technical’s weekly technology intelligence newsletter.
- Your email and selected fields are used only to deliver the newsletter.
- We never share your information with third parties.
- You can unsubscribe anytime via the link in each email.
See our Privacy Policy for details.
Takes about a minute · Unsubscribe anytime
Comments