Troy– Author –
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Advanced Thermal Interface Materials Evolve to Combat AI Chip Heat, Spanning Liquid Metals to Polymer Composites
Exponential Industry USA Overview Thermal Interface Materials (TIMs) are becoming indispensable for semiconductor thermal management, addressing the escalating power density and heat generation in AI processors. Current packaging relies ... -
PackCon 2026 to Discuss How Sustainable Packaging Drives Business Value
EuroCham Singapore Singapore Overview Scheduled for August 26, 2026, in Singapore, PackCon 2026 is an international event dedicated to exploring how sustainable packaging drives business value. Industry leaders, policymakers, sustainabil... -
JCET Achieves 79.4% YoY Net Profit Growth in H1 2026, Accelerates Advanced Packaging to Meet AI Demand
PR Newswire China Overview JCET Group, a leading global outsourced semiconductor assembly and test (OSAT) provider, reported impressive financial results for the first half of 2026, with net profit attributable to shareholders surging by... -
Amkor Technology Expands U.S. Advanced Packaging Footprint by 67 Acres in Arizona, Bolstering Domestic Manufacturing
Amkor Technology, Inc. USA Overview Amkor Technology has secured an additional 67 acres (approximately 270,000 square meters) adjacent to its existing advanced packaging and test campus in Arizona, significantly expanding its U.S. back-e... -
Hanmi Semiconductor Invests $92 Million in Largest-Ever 8th Plant for AI/HBM Demand, Enters U.S. Market
Pulse 2.0 South Korea Overview South Korean Hanmi Semiconductor is investing approximately 130 billion won (about $92 million) to construct its largest-ever 8th production facility, a direct response to the explosive demand for AI and Hi... -
China Invests 40 Billion Yuan ($5.5 Billion) in New Advanced Packaging Projects for AI/HPC to Prepare for Next Chip Shortage
All-About-Industries China Overview China's advanced packaging industry is embarking on a new wave of capacity expansion to meet the escalating demand for AI and High-Performance Computing (HPC) chips. Between May and July 2026, approxim... -
Hanmi Semiconductor Leads HBM4 TC Bonder Market, Diversifies Client Base with Micron Deals to Reduce SK Hynix Dependency
digitimes Taiwan Overview Hanmi Semiconductor has gained a significant lead over competitor Hanwha Semitech in the crucial thermal compression (TC) bonder market for High Bandwidth Memory (HBM) manufacturing. This market advantage is dri... -
SK Hynix Pioneers Optical Interconnects Beyond HBM, Outlines Roadmap for AI Bandwidth Challenges
Adalytica South Korea Overview SK Hynix is charting a course for optical chip connections that extend beyond High Bandwidth Memory (HBM) to address critical bandwidth limitations in large-scale AI systems. A recent Nature Electronics rev... -
HBM4 Breaks Bottlenecks: Hybrid Bonding Delivers 20%+ Thermal Reduction, 40% Power Efficiency Boost, 2.0TB/s+ Bandwidth
SemiHub.io International Overview HBM4, the next-generation High Bandwidth Memory, is set to significantly advance AI/HPC performance by doubling its I/O width to 2048 bits, targeting over 2.0 TB/s bandwidth per stack and substantial pow... -
SK Hynix Secures HBM4 Future: 70% Price Surge, 2026 Capacity Sold Out, and $3.87B US Investment for Advanced Packaging Independence
Adalytica and others South Korea Overview SK Hynix has signaled its dominance in the High Bandwidth Memory (HBM) market by reportedly increasing HBM4 prices by 70% for its 2026 supply, which is already entirely presold. Concurrent with t...
