Key Findings
Hanmi Semiconductor announced an investment of approximately 130 billion won (about $92 million USD) to build its largest-ever 8th production facility, a direct response to the surging global demand for AI and High Bandwidth Memory (HBM) manufacturing equipment. Concurrently, the company revealed its strategic entry into the U.S. semiconductor market with the establishment of HANMI USA, signaling an aggressive move to solidify its leadership in the rapidly expanding AI and HBM sectors.
Technical and Market Details
- The new 8th plant will be established through the acquisition and refurbishment of an existing Mercury factory in Incheon’s Juan National Industrial Complex, with mass production slated to commence in the second quarter of 2027. This rapid facility acquisition strategy aims to significantly shorten the time-to-production.
- Key products manufactured at the new facility will include thermal compression (TC) bonders, hybrid bonders, and 2.5D packaging equipment, all indispensable for HBM manufacturing and AI semiconductors. These advanced tools are crucial for enabling the stacking and integration of next-generation memories like HBM4 and complex AI accelerators.
- Hanmi Semiconductor will enhance its lineup of HBM4-related TC bonders and 2.5D packaging equipment to meet demand from leading AI semiconductor players such as NVIDIA and SK Hynix. The establishment of HANMI USA will particularly strengthen customer support and expand market share in the North American region.
Background and Industry Context
The advancement of AI has driven demand for high-performance HBM and sophisticated packaging technologies to unprecedented levels. HBM is a critical component that determines the performance of AI accelerators, and its production capacity often acts as a bottleneck for the overall supply of AI chips. TC and hybrid bonders are essential equipment for precisely bonding these HBM stacks, making the production capacity of equipment manufacturers like Hanmi Semiconductor pivotal for the entire industry’s growth.
Amidst global semiconductor supply chain restructuring, various countries, including the U.S., are pushing to strengthen domestic production capabilities. Hanmi Semiconductor’s entry into the U.S. market aligns with these geopolitical shifts and the accelerated investment in AI semiconductor-related industries within the U.S. This move is a strategic one for the company to establish a global competitive advantage and build a foundation for long-term growth.
Outlook
This substantial investment and entry into the U.S. market represent a decisive step for Hanmi Semiconductor to cement its position as a leading technology supplier in the AI and HBM sectors. With the new plant commencing operations in Q2 2027, the company’s production capacity will dramatically increase, enabling it to meet surging customer demand in a timely manner. This not only contributes to the stabilization of the global AI semiconductor ecosystem supply but also serves as a potent factor for significantly expanding Hanmi’s revenue and market share. Furthermore, establishing a U.S. presence harbors potential for future partnerships and technological collaborations.
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