Troy– Author –
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Pushing the Limits of 3D Integration: Imec and EVG Achieve Record 200nm Hybrid Bonding Pitch
imec ベルギー Overview Imec and EV Group (EVG) have announced a major breakthrough in 3D integration, demonstrating wafer-to-wafer hybrid bonding with an unprecedented 200nm copper interconnect pad pitch on 300mm wafers. Achieved with a ... -
ASE Unveils Industry-First Automated 310mm Panel-Level Packaging Line for AI and Chiplet Integration
AnySilicon Taiwan Overview Advanced Semiconductor Engineering (ASE) has developed an automated 310mm x 310mm panel-level packaging (PLP) production line, a significant advancement for AI processors and chiplet architectures. This industr... -
Malaysia Launches National Consortium to Accelerate Advanced Semiconductor Packaging Development Within Two Years
SME.asia Malaysia Overview Malaysia has established the Malaysia Advanced Packaging Consortium (MAPC) with a total funding of RM185 million ($39 million USD) to develop domestic advanced semiconductor packaging capabilities within two ye... -
SK Hynix and Samsung Unveil Production-Ready HBM4 with Hybrid Bonding, Targeting H2 2026 Mass Production
Techfund South Korea Overview At CES 2026, SK Hynix showcased a 16-layer, 48GB HBM4 device leveraging advanced Through-Silicon Via (TSV) and hybrid bonding for high density, while Samsung presented a 12-layer, 36GB HBM4 stack focused on ... -
AMD Commits Over $10 Billion to Taiwan’s AI Ecosystem for Advanced Packaging and EFB Technology Expansion
EE Times Taiwan Overview AMD announced an investment exceeding $10 billion into Taiwan's AI ecosystem, bolstering advanced packaging capabilities and R&D. This initiative specifically targets Elevated Fanout Bridge (EFB) based 2.5D p... -
TSMC Repurposes Mature Node Capacity to CoWoS for AI Accelerators Amid Critical Supply Shortage
Tom's Hardware Taiwan Overview TSMC is reallocating 40-90nm mature node capacity to expand its CoWoS advanced packaging and silicon interposer fabrication, directly addressing a critical supply bottleneck for AI accelerators. This strate... -
Amkor Technology Targets $11B Revenue by 2030, Anchored by $7 Billion Arizona Advanced Packaging Investment
MarketBeat USA Overview Amkor Technology aims to exceed $11 billion in revenue by 2030, driven by a $7 billion, two-phase investment in its Arizona advanced packaging and test campus. High-volume manufacturing is slated to begin in 2028,... -
Regulatory & Policy Shifts Reshape Global Biologics Manufacturing Strategy: Focus on EU Reform, UK Decentralization, and US Tariffs
IMAPAC UK Overview Regulatory and policy shifts, including EU Pharma Reform, UK decentralized manufacturing initiatives, and U.S. tariffs, are fundamentally reshaping global biologics manufacturing strategies. Notably, the UK has establi... -
US Department of Veterans Affairs Launches MDMA-Assisted Mental Health Therapy Trial
VA News (US Department of Veterans Affairs) USA Overview The U.S. Department of Veterans Affairs (VA) has initiated a clinical trial for MDMA-assisted mental health therapy, following the FDA's Breakthrough Therapy designation for MDMA, ... -
WuXi Biologics Intensifies Focus on South Korea to Bolster K-Biotech Partnerships Amid US Pressure
BioCentury (Chosun Biz) South Korea Overview WuXi Biologics is expanding its sales efforts in South Korea, actively targeting K-biotech companies amidst increasing U.S. legislative scrutiny on Chinese biotech firms. As a major global Con...
