Adhesives & Sealants– category –
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Kynix Explains HBM4 Hybrid Copper Bonding Achieves Over 20% Thermal Performance Improvement, Enabling Stable Clock Speeds Under AI Loads
Kynix China Overview Kynix explains that Hybrid Copper Bonding (HCB) technology for HBM4 improves thermal performance by over 20%. This method eliminates solder bumps and underfill, directly connecting copper layers to significantly redu... -
Samsung Announces HBM4E Hybrid Copper Bonding Reduces Package Height by Over 15% While Improving Thermal Characteristics
Sammy Fans South Korea Overview Samsung has presented research on its HBM4E packaging strategy, emphasizing that Hybrid Copper Bonding (HCB), which eliminates underfill materials, offers superior thermal properties compared to convention... -
Unpacking the EV Battery Pack Thermal Gap Filler Market: Growth, Key Players, and Technological Imperatives
Inkrich Blog Japan Overview The inkrich blog reveals a rapidly expanding market for thermal gap fillers in electric vehicle (EV) battery packs, driven by the escalating demand for enhanced EV performance and efficiency. Critical for batt... -
Future of HBM Hinges on Cooling Innovations: TSVs, High-Conductivity Underfills, and Hybrid Bonding for HBM5+ Are Key
AI Strategies by Kim Joung-Ho South Korea Overview The future of High Bandwidth Memory (HBM) and High Bandwidth Flash (HBF) critically depends on cooling innovations to manage extreme thermal densities. Key advancements include Through-S... -
Samsung Boosts AI Performance in Galaxy S26/S26+ with Redesigned Vapor Chamber and Customized TIMs
Samsung AU Australia Overview Samsung has equipped its new Galaxy S26 and S26+ smartphones with an advanced thermal management system to maintain peak AI performance. This includes a redesigned vapor chamber and customized Thermal Interf... -
Panasonic Industry Europe Offers Thermal Interface Materials and Semiconductor Device Materials as Part of Expanded Electronic Materials Portfolio
Panasonic Industry Europe GmbH Germany Overview Panasonic Industry Europe is supplying advanced Thermal Interface Materials (TIMs) and semiconductor device materials within its electronic materials product portfolio. These materials are ... -
Ring PCB Details Advanced Thermal Management for High-Power PCBAs: Strict TIM Application, Customized Thick Copper Reflow, and High-Density Thermal Via Arrays
Ring PCB China Overview Ring PCB provides solutions for ensuring thermal stability in high-power Printed Circuit Board Assembly (PCBA) systems through rigorous application of Thermal Interface Materials (TIMs), customized reflow temperat... -
Cutter Electronics Unveils New Thermal Interface Materials (TIMs) for LED and Heatsink Applications
Cutter Electronics Australia Overview Cutter Electronics has announced new thermal interface materials (TIMs), including thermal pads and compounds, essential for efficient thermal management in LEDs and heatsinks. These new products are... -
arXiv Paper Presents Mitigation Techniques for Thermal-Induced Performance Degradation in HBM4/HBM5 3.5D Heterogeneous Packages
arXiv USA Overview A new arXiv paper focuses on addressing thermal-induced memory leakage and soft errors in HBM4/HBM5 vertical stitching interfaces within 3.5D heterogeneous packages. The research proposes improved HBM stacking methods ... -
ECTC 2026 Reveals Breakthroughs in Advanced Packaging: CoWoS-R Warpage Management, IBM’s DBrM, and Nanocrystalline Diamond Cu/Sn Microbumps Highlight Thermal and Integration Advances
SemiAnalysis USA Overview ECTC 2026 showcased advancements in underfill and sealant materials for CoWoS-R warpage management. IBM's 'Direct Bridge Multi-die (DBrM)' using die-edge adhesive technology was introduced, alongside collaborati...
