Adhesives & Sealants– category –
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Glass Bubbles Revolutionize Adhesives and Sealants: Delivering Ultra-Lightweight and Enhanced Thermal Performance
Specialty Adhesives & Sealants Blog USA Overview Glass bubble materials are transforming low-density adhesives and sealants by offering exceptional lightweighting, insulation, and processing advantages. These lightweight hollow glass mic... -
Resonac Reports Strong Q1 2026 Earnings Driven by AI-Powered Semiconductor Materials
GuruFocus Japan Overview Resonac Holdings announced a strong Q1 2026, with its semiconductor and electronic materials segment achieving a 21% year-on-year revenue increase. This growth was primarily fueled by robust demand for advanced s... -
Henkel Pioneers Mid-Temperature Sealing for Anodizing, Boosting Efficiency and Sustainability
IPCM Germany Overview Henkel has launched Bonderite M ED 11204, a novel mid-temperature sealing technology for aluminum anodizing processes. This solution drastically reduces energy consumption, CO2 emissions, and water usage compared to... -
Sumitomo Chemical Unveils ‘ELA Series’ High-Purity Alumina for Advanced Semiconductors
AL Circle Japan Overview Sumitomo Chemical has launched the ELA Series, a new range of high-purity alumina products targeting advanced semiconductor manufacturing for AI and high-performance electronics. This series represents the world'... -
Henkel Launches High-Performance Structural Adhesive for Automotive Body-in-White Assembly
Assembtek Germany Overview Henkel has introduced the Teroson EP 52 Series, a new structural adhesive designed for automotive Body-in-White (BIW) production. This heat-curable, solvent-free, one-component adhesive significantly enhances s... -
Adhesives & Sealants Weekly Report May 18, 2026
📄 Weekly Report May 18, 2026 (PDF) — Download Weekly Report May 18, 2026 (PDF) — DownloadDownload 🎙 Podcast May 17, 2026 (MP3) — Play & Download Adhesives_SealantsEnglishPodcast_20260517_sample.mp3Download -
Resonac Raises Mid-Year Profit Outlook, Driven by Robust Demand for AI Semiconductor Materials
レゾナック Japan Overview Resonac announced a significant upward revision to its consolidated net profit forecast for the first half of 2026, from 20 billion JPY to 38 billion JPY, driven by strong performance in its AI semiconductor mat... -
ASMC 2026 Convenes Global Semiconductor Leaders to Tackle Advanced Manufacturing Challenges and Accelerate Innovation
SEMI USA Overview The Advanced Semiconductor Manufacturing Conference (ASMC 2026), held from May 11-14, brought together semiconductor manufacturers, equipment and materials suppliers, and academia to discuss innovative strategies and me... -
Henkel Unveils Sustainable Sealants for Beverage and Food Cans at METPACK 2026, Meeting Evolving Safety and Efficiency Demands
Henkel Germany Overview Henkel introduced its next-generation, eco-friendly sealants for beverage and food cans at METPACK 2026. New offerings include water-based Darex WBC 4020 and Darex WBC 833 with superior application properties, pht... -
Heraeus Electronics Unveils Advanced Die-Attach Materials for High-Reliability Power Electronics at PCIM Europe 2026
Heraeus Electronics Germany Overview Heraeus Electronics unveiled cutting-edge material technologies for power electronics at PCIM Europe 2026. New offerings include mAgic® PE340 silver pressure sintering paste for high-density packaging...
