Adhesives & Sealants– category –
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Henkel Unveils Next-Gen Teroson EP 52 Series: High-Damping Structural Adhesives for Automotive Lightweighting and NVH Reduction
Henkel Germany Overview Henkel has launched the Teroson EP 52 Series, a new high-performance structural adhesive engineered for automotive manufacturing, combining superior bonding strength with advanced vibration damping capabilities. U... -
JSR Fortifies Advanced Semiconductor Material Production and R&D in Taiwan to Meet Surging AI Demand
JSR株式会社 Japan Overview JSR, a leading semiconductor materials manufacturer, announced a significant expansion of its production and R&D capabilities in Taiwan, effective April 2026. This strategic move, driven by key customer req... -
Sumitomo Chemical Develops New Ultra-Low Alpha, High-Thermal-Conductivity Alumina Filler for Advanced Semiconductors
住友化学 Japan Overview Sumitomo Chemical has developed a new 'ELA series' of high-purity alumina, boasting extremely low alpha-particle emissions and enhanced thermal conductivity, specifically for advanced semiconductors. This innovati... -
Sumitomo Bakelite Announces Price Increase for Semiconductor Encapsulation Epoxy Molding Compounds
住友ベークライト株式会社 Japan Overview Sumitomo Bakelite has announced a price revision for its SUMIKON™ EME series of epoxy resin molding compounds for semiconductor encapsulation, effective June 1, 2026, with increases ranging from 10... -
Henkel Unveils Silicone-Free Thermal Gap Filler and High-Strength Conductive Adhesive for Advanced EV Battery Thermal Management
Henkel Germany Overview Henkel has introduced two new thermal interface materials designed to enhance EV battery thermal management: the Bergquist TGF 2030APS gap filler, which is silicone-free with a thermal conductivity of 1.7 W/m·K, a... -
Plexus Introduces Thermomechanical Polyurethane Adhesives for Integrated Thermal Management and Structural Bonding in EVs and Power Electronics
ITW Performance Polymers (Plexus) USA Overview Plexus has launched a new series of thermomechanical polyurethane structural adhesives, including the DT2630LD, designed to concurrently manage heat and provide robust structural bonding in ...
