Adhesives & Sealants– category –
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Master Bond Offers Epoxy Underfill Formulations to Boost Reliability for Flip-Chip and CSP Assemblies
Master Bond USA Overview Master Bond provides epoxy underfill formulations designed to significantly enhance the long-term reliability of flip-chip and chip-scale packaging (CSP) assemblies. These materials achieve excellent adhesion to ... -
Saint-Gobain Offers High-Performance Adhesives and Bonding Tapes, Including PFAS-Free Alternatives, for EV Battery Applications
Saint-Gobain France Overview Saint-Gobain provides comprehensive high-performance adhesive and bonding tape solutions, gasket foams, spacer tapes, and specialty films for demanding industries like electronics, energy, aerospace, and espe... -
Henkel Unveils Loctite ABLESTIK CDF900 Series Conductive Die Attach Film with >8 W/m-K Thermal Conductivity for AI and HPC Packages
SpecialChem Germany Overview Henkel Adhesive Technologies has introduced the new Loctite ABLESTIK CDF900 series conductive die attach film (cDAF), revolutionizing advanced packaging for AI accelerators and HPC processors. This innovative... -
Krayden Supplies High Thermal Conductivity Hysol GR60 Series EMC for IPMs, Enhancing Reliability of Automotive and Industrial Modules with 2.2 W/mK
Krayden USA Overview Krayden offers advanced encapsulation solutions for Intelligent Power Modules (IPMs), featuring Hysol GR60 series epoxy mold compounds (EMC) with superior thermal conductivity. The GR60 HT variant achieves a thermal ... -
Krayden Delivers Advanced Material Solutions for Flip Chip BGA to Enhance Interconnect Density, Thermal Paths, Warpage Control, and Reliability
Krayden USA Overview Krayden provides comprehensive material solutions addressing critical challenges in Flip Chip Ball Grid Array (FCBGA) packages, including interconnect density, thermal path design, package warpage, and long-term reli... -
Indium Corporation Showcases High Thermal Conductivity TIMs and Sintering Pastes for AI at SEMICON Taiwan
Indium Corporation USA Overview Indium Corporation exhibited innovative materials supporting AI technology at SEMICON Taiwan, highlighting Heat-Spring® compressible metal TIMs and solder TIMs for superior thermal conductivity in high-pow... -
MDPI Review Compares Advanced Semiconductor Packaging: Spotlighting Thermal Management and Reliability Challenges
MDPI Switzerland Overview A review paper published in MDPI critically compares advanced packaging architectures, including 2D, 2.5D, and 3D integration, detailing challenges in thermal management, warpage from thermomechanical mismatch, ... -
AI Technology Unveils Enhanced Thermal Dissipation Molding Underfill for HBM and 3D DRAM to Boost Package Reliability
AI Technology, Inc. USA Overview AI Technology, Inc. (AIT) has announced a new Molding Underfill (MUF) with significantly enhanced thermal dissipation, targeting advanced semiconductor packaging like HBM, 3D DRAM, and AI processors. This... -
Adhesives & Sealants Weekly Report August 30, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report August 30, 2026 (PDF) — Download Weekly Report August 30, 2026 (PDF) — DownloadDownload 🎙 Podcast August 30, ... -
US FTC Wins Court Battle, Blocks Henkel’s Proposed $725M Acquisition of Liquid Nails
Cooley USA Overview On August 17, 2026, the U.S. Federal Trade Commission (FTC) successfully blocked Henkel's proposed acquisition of PPG's Liquid Nails business in court. The FTC argued that the merger would eliminate competition in the...
