Key Findings
Krayden provides epoxy mold compound (EMC) solutions for Intelligent Power Modules (IPMs) that deliver high thermal conductivity and exceptional reliability. Specifically, Hysol’s GR60 series EMC has been developed to meet the stringent thermal requirements of IPM applications, with the GR60 HT grade boasting an impressive thermal conductivity of 2.2 W/mK. This technology is crucial for ensuring the long-term performance and durability of IPMs in motor control, industrial applications, and automotive electronics.
Technical / Clinical Details
IPMs integrate power devices and control circuits, and their high level of integration and high-power operation necessitate efficient thermal management and robust environmental protection. Krayden widely employs transfer molding encapsulation, with the Hysol GR60 series EMC playing a central role.
- High Thermal Conductivity: The GR60 HT achieves a high thermal conductivity of 2.2 W/mK, efficiently dissipating heat generated within the IPM to the outside. This suppresses device temperature rise and prevents thermal degradation.
- Superior Reliability: In addition to high thermal conductivity, the GR60 series offers excellent moisture resistance, thermal cycling performance, and mechanical strength, guaranteeing the long-term reliability of IPMs in harsh operating environments. This makes them suitable for applications where failure is unacceptable, such as industrial equipment and automotive systems.
- Flowability and CTE Control: The flowability of the EMC is vital for uniform filling even into the intricate internal structures of IPMs. Furthermore, by minimizing the Coefficient of Thermal Expansion (CTE) mismatch between the chip and the substrate, it prevents package warpage and cracks caused by thermal stress.
Beyond transfer molding, Krayden also recommends direct potting with liquid encapsulants (epoxy or silicone resins) for power modules. In this approach, careful material selection, considering specific thermal performance, delamination resistance, and exposure to thermal cycling, is extremely important.
Background & Context
The rapid development of fields such as electric vehicles (EVs), renewable energy systems, and industrial automation has led to an increased demand for high-efficiency and reliable power electronics. IPMs are central components in these applications, requiring higher power density and performance under severe operating conditions. Consequently, thermal management and robust encapsulation of IPMs are critical factors that directly impact not only device performance but also the safety and lifespan of the entire system.
Strategic Significance & Outlook
High thermal conductivity EMCs, such as the Hysol GR60 series offered by Krayden, are indispensable technologies for accelerating the growth of the IPM market. Particularly in the automotive electronics sector, with the proliferation of EVs, the demand for IPMs in motor control and battery management systems is expanding, and improving their reliability significantly influences market competitiveness. Moving forward, the development of higher-performance, more thermally resistant, and more reliable encapsulation solutions will continue to be a major theme in the power electronics industry.
Source: https://www.krayden.com/articles/intelligent-power-module
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