Adhesives & Sealants– category –
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3M Supplies 5590H Thermally Conductive Acrylic Interface Pad for IC Chips and EV Batteries
Facebook (3M) USA Overview 3M is supplying its 5590H Thermally Conductive Acrylic Interface Pad, designed to provide an efficient heat transfer path between high-heat-generating components like IC chips and EV batteries, and their respec... -
WEVO-CHEMIE Develops High-Insulation, Thermally Conductive Polyurethane Potting System for EV Battery BMS
WEVO-CHEMIE GmbH Germany Overview WEVO-CHEMIE GmbH has developed WEVOPUR 60210 FL T, a polyurethane potting system for multilayer PCBs in EV battery management systems (BMS), offering 0.8 W/m·K thermal conductivity and dielectric strengt... -
Wevo Unveils WEVOSIL 26040 FL, a 4 W/m·K Silicone Gap Filler for High-Performance Thermal Management
Wevo Germany Overview Wevo has launched WEVOSIL 26040 FL, a new silicone gap filler thermal interface material (TIM) boasting a thermal conductivity of 4 W/m·K. Optimized for power electronics and battery technologies, this material feat... -
Moldex3D Compression Molding Simulation Achieves Semiconductor Package Defect Prediction and Quality Enhancement
Rheologist gaze & solutions (Moldex3D) Taiwan Overview Moldex3D provides CAE simulation tools for compression molding processes in advanced semiconductor packaging, enabling precise simulation of how encapsulating materials like epoxy mo... -
Master Bond Offers Eco-Friendly Solvent-Free, Halogen-Free, RoHS-Compliant Adhesive and Encapsulation Solutions
Master Bond USA Overview Master Bond offers a wide range of solvent-free, halogen-free, RoHS-compliant, and energy-efficient adhesives, sealants, coatings, potting, and encapsulation compounds, emphasizing reduced environmental impact. N... -
Advanced Die Attach Solder Paste for High-Power Packaging: Achieving >60-70 W/m·K Thermal Conductivity and Precision Filling
Global SMT & Packaging Global Overview A Global SMT & Packaging article emphasizes the critical role of die attach solder paste in high-power packaging, achieving excellent thermal conductivity of 60-70 W/m·K (and >70 W/m·K with C... -
Tom’s Hardware Reports: TSMC Achieves 6-Micron Hybrid Bonding, Full HBM Integration Potentially Delayed to HBM4E/HBM5 (2027-Late 2020s)
Tom's Hardware USA Overview Tom's Hardware reports on the 2026 status of hybrid bonding, revealing TSMC's SoIC achieves 3.5D integration by combining hybrid-bonded stacks with CoWoS modules on silicon interposers, reaching 6-micron preci... -
P Equity Research Analyzes Advanced Semiconductor Packaging: Illuminating the Roles of Underfill and Mold in 2.5D and CoWoS Architectures
P Equity Research Global Overview A P Equity Research article delves into advanced semiconductor packaging, including 2.5D and CoWoS architectures, detailing the crucial role of adhesives and encapsulants when processors and memory layer... -
Master Bond Offers High-Strength, High-Reliability Die Attach Epoxy Adhesives for Microelectronics
Master Bond USA Overview Master Bond provides die attach epoxy adhesives for microelectronic semiconductor packaging and chip-on-board assemblies, featuring high bond strength, thermal cycling resistance, mechanical shock/vibration resis... -
Master Bond Offers Epoxy Underfill Formulations to Boost Reliability for Flip-Chip and CSP Assemblies
Master Bond USA Overview Master Bond provides epoxy underfill formulations designed to significantly enhance the long-term reliability of flip-chip and chip-scale packaging (CSP) assemblies. These materials achieve excellent adhesion to ...
