Adhesives & Sealants– category –
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Graphite Proves Essential for NEV Battery Thermal Management, Cutting Peak Temperatures by up to 35%; Sheen Technology Offers Lightweight Graphene Thermal Pads
Sheen Technology China Overview Graphite is highlighted as a critical material for thermal management in New Energy Vehicle (NEV) batteries, capable of homogenizing hot spots and reducing peak temperatures by up to 35% due to its high in... -
BYK Acquires Radar Dome Measurement System Company, Bolstering Presence in Autonomous Driving Market and Anticipating Related Adhesive and Sealant Demand
Adhesives & Sealants Industry Germany Overview BYK, a German specialty chemicals manufacturer, announced a strategic acquisition of a company specializing in radar dome measurement systems for the autonomous driving market. This move str... -
AI and EVs Drive 2026 Semiconductor Market, High-Bandwidth Memory (HBM) and Advanced Manufacturing Nodes Emerge as Key Growth Themes
Kraken USA Overview The 2026 semiconductor industry is experiencing significant growth, propelled by the rapid expansion of AI infrastructure, continued data center augmentation, and automotive electrification. Key growth themes include ... -
AI Fuels “Golden Age” of Advanced Packaging: Amkor-TSMC 10-Year CoWoS Deal Strengthens U.S. Supply Chain, ASE Builds 6 New Fabs Globally
TechNews Taiwan Overview 2026 marks the "golden age" of advanced packaging, with AI-driven demand prompting massive investment expansions from global packaging and test manufacturers. Amkor secured a 10-year long-term cooperation agreeme... -
Master Bond Unveils UV16Med-FD, a UV Curable Epoxy with Fluorescent Dye for Medical Devices, Ensuring ISO 10993-5 Biocompatibility and Enhanced Defect Detection
AZoM USA Overview Master Bond has launched UV16Med-FD, a single-component, low-viscosity, UV curable epoxy system with an integrated fluorescent dye for medical device applications. This innovative adhesive allows for visual inspection o... -
TSMC Commits Additional $100 Billion to U.S. Semiconductor Manufacturing and Packaging, Bringing Total Investment to $265 Billion for 12 Facilities
NIST - National Institute of Standards and Technology USA Overview TSMC has announced an additional $100 billion investment in advanced semiconductor manufacturing and packaging facilities in the U.S., as part of a historic trade and inv... -
Aduro and ECOCE Launch HCT Testing in Mexico for Flexible Plastic Packaging Waste, Recovering Liquid Hydrocarbons from Multi-Layer Adhesives-Containing Materials
Aduro Clean Technologies Canada Overview Aduro Clean Technologies and ECOCE, A.C. have launched a Hydrochemolytic™ Technology (HCT) testing campaign for post-consumer flexible plastic packaging waste streams in Mexico. This phase aims to... -
Bosch Secures $225M in U.S. Commerce Department Funding for $2 Billion SiC Semiconductor Fab Conversion in California, Boosting Domestic Production
Bosch Germany Overview Bosch has secured up to $225 million in direct funding from the U.S. Department of Commerce, part of a broader $2 billion investment to convert its Roseville, California facility into a silicon carbide (SiC) semico... -
German Industrial Adhesives Giant Jowat Establishes South Korean Subsidiary to Boost Automotive, Electronics, and Packaging Market Presence
European Coatings Germany Overview German industrial adhesive manufacturer Jowat announced the establishment of its new subsidiary, Jowat Korea, in Seoul. This strategic expansion is driven by the increasing demand for industrial adhesiv... -
Master Bond Strengthens Broad USP Class VI Compliant Adhesive Line for Disposable and Reusable Medical Devices, Ensuring Extensive Sterilization Resistance
Master Bond USA Overview Master Bond now offers an enhanced, comprehensive line of high-performance adhesives for disposable and reusable medical device assembly, fully compliant with USP Class VI requirements. This diverse range include...
