Adhesives & Sealants– category –
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Intel Seeks Senior Module Test Engineer in Kulim, Malaysia to Advance CUF Module Improvement and New Material Application for Advanced Packaging
Jooble USA Overview Intel is recruiting a Senior Module Test Engineer in Kulim, Malaysia, to lead the design and development of advanced manufacturing test processes. This role supports post-packaging burn-in, final test, and system test... -
AtlasPCB Releases BGA Underfill Selection Guide Comparing Capillary Flow and Reworkable Formulations for Automotive, Aerospace
AtlasPCB Unknown Overview AtlasPCB has published a BGA (Ball Grid Array) underfill selection guide as part of its PCB engineering insights blog series. The article comprehensively compares capillary flow, molded underfills, and reworkabl... -
Lenovo Legion Y70 2026 Gaming Phone Boosts Cooling with 12 W/mK Liquid Metal and High-Conductivity Gel
Cashkr China Overview The Lenovo Legion Y70 2026 gaming phone features a significantly enhanced cooling system, combining a 5,500 mm² vapor chamber with 12 W/mK liquid metal thermal conductivity and high thermal conductive gel. This setu... -
H.B. Fuller Acquires Advanced Medical Solutions for £660M, Bolstering Medical Adhesives Technology and Global Footprint
Perivan USA Overview H.B. Fuller announced its recommended cash acquisition of Advanced Medical Solutions Group plc (AMS), a UK-based developer and manufacturer of innovative tissue-healing technologies, for approximately £660 million. A... -
CuspAI Launches ‘AI Materials Foundry’ with Resonac and 45+ Partners to Accelerate Materials Discovery in Semiconductors, Energy, and Climate Change
Morningstar (Business Wire) UK Overview CuspAI has launched the 'AI Materials Foundry,' a global network to accelerate breakthrough materials discovery in semiconductors, energy, and climate change, with Resonac Holdings as a founding me... -
Sheen Technology Publishes Guide for ‘Punchable Silicone-Free Thermal Conductive Material’ for EV & AI Hardware Manufacturing
Sheen Technology Unknown Overview Sheen Technology has released a guide on selecting 'Punchable Silicone-Free Thermal Conductive Material' for high-capacity electronics manufacturing. This material is gaining importance as an alternative... -
Acrylic Resins Dominate Pressure Sensitive Adhesives Market, Driving Eco-Friendly Products; Dow and Henkel Expand Emissions Reduction Partnership
Credence Research USA Overview This article outlines a market research report on the Pressure Sensitive Adhesives (PSA) market, driven by key players like 3M, Henkel AG, and Avery Dennison. Acrylic resins hold the largest share, supporti... -
Kansai Nerolac Strengthens Indian Adhesives Market Presence with Strategic Partnership Between Nerofix and Italy’s Durante Adesivi
Indian Chemical News India Overview Nerofix Private Limited, a subsidiary of Kansai Nerolac Paints, has formed a strategic partnership with Italy's Durante Adesivi S.p.A. This collaboration aims to bolster Kansai Nerolac's presence in th... -
APPLIED Adhesives Acquires Industrial Sales and Distribution, Expanding Silicone Solutions and East Coast Presence
Specialty Adhesives and Sealants (AdhesivesMag.com) USA Overview APPLIED Adhesives has acquired Industrial Sales and Distribution Inc. (ISD), a distributor of adhesives and silicones. This acquisition strengthens APPLIED Adhesives' posit... -
Wafer-Level Packaging: Scaling to $28 Billion by 2035 Amidst Miniaturization Demands
Market Research Unknown Overview A new market research report forecasts the Wafer Level Packaging (WLP) market to surge from $11.97 billion in 2026 to $28.81 billion by 2035. This substantial growth is primarily driven by the relentless ...
