Adhesives & Sealants– category –
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Ajinomoto to Secure ABF Supply Capacity for AI Chip Demand Until 2030, Prioritizing Production Expansion Over Price Hikes
GIGAZINE Japan Overview Ajinomoto announced its capability to meet the surging demand for Ajinomoto Build-Up Film (ABF), a critical interlayer dielectric for advanced semiconductor packaging, until 2030, driven by the exponential growth ... -
Resonac’s Liquid Encapsulant Patent Upheld for 2.5D AI Semiconductor Packages, Ensuring Enhanced Reliability
Resonac Japan Overview Resonac announced that the Japan Patent Office upheld the validity of its Japanese patent (No. 7687499) for a liquid encapsulant critical for 2.5D semiconductor packages in generative AI applications. This technolo... -
Adhesives & Sealants Weekly Report May 13, 2026
📄 Weekly Report June 13, 2026 (PDF) — Download Weekly Report June 13, 2026 (PDF) — DownloadDownload 🎙 Podcast June 13, 2026 (MP3) — Play & Download Adhesives_SealantsEnglishPodcast_20260613.mp3Download -
Indium Corporation Unveils AuLTRA® 75 Gold-Based Die-Attach Preforms for 5G, Military, and Aerospace GaN Devices at IMS
Industrial Electronics USA Overview Indium Corporation announced it will feature its high-reliability, gold-based precision die-attach preforms at the International Microwave Symposium (IMS). A highlight is AuLTRA® 75, an off-eutectic Au... -
Chase Corporation Acquires Sheldahl from Flex, Strengthening High-Reliability Material Portfolio for Aerospace and Medical Applications
Chase Corporation USA Overview Chase Corporation announced the acquisition of Sheldahl from Flex, significantly expanding its engineered materials portfolio. Sheldahl specializes in designing and manufacturing coated films, laminates, an... -
AI Theme Propels Nikkei 225, Driving Significant Gains for Advanced Packaging Material Companies like Resonac and Mitsui Kinzoku
IG Japan Overview The latest Nikkei 225 analysis highlights the significant impact of the AI theme on the market, showing substantial gains for chemical manufacturers like Resonac, a global leader in advanced packaging materials and epox... -
ECTC 2026: Intel Foundry and Amkor Announce Advanced Packaging Technologies for AI/HPC and U.S. Manufacturing Capacity Expansion
Intel Newsroom, Amkor Technology Blog, Semiconductor Engineering USA Overview The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased advanced packaging technologies redefining scalability limits for AI and high-pe... -
pH- and Cellulase-Triggered Bio-Based Adhesive Facilitates Pharmaceutical Blister Pack Recycling
RSC Publishing (Green Chemistry) Unknown Overview Researchers have developed a biodegradable, bio-based adhesive to aid in the recycling of pharmaceutical blister packaging. Composed of cellulose nanocrystals, chitosan, and a bifunctiona... -
DELO Unveils DELO PHOTOBOND LA, a Light-Activatable Adhesive for High-Volume LiDAR Production
Photonics Spectra Germany Overview DELO has launched DELO PHOTOBOND LA, a light-activatable adhesive specifically designed for high-volume LiDAR system production. This adhesive is ideal for critical mirror and cover window bonding in au... -
DiversiTech Acquires Polymer Adhesives, Accelerating Expansion in HVAC-Focused Specialty Adhesives and Sealants Market
Adhesives & Sealants Industry USA Overview DiversiTech Corp. has acquired Polymer Adhesives Holdings LLC, a manufacturer of high-performance duct sealants, adhesives, and fire-stopping materials. This acquisition substantially expands Di...
