Adhesives & Sealants– category –
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Adhesives Identified as Key Input for Composite Can Manufacturing Plants as Demand Rises for Eco-Friendly Packaging
openPR.com International Overview Demand for composite cans is rapidly increasing in the food, beverage, and consumer goods industries due to their eco-friendly properties and versatility. These cans, made from multi-layered structures o... -
Aeluma Secures $30 Million US CHIPS Act Funding to Advance Scalable Non-InP Semiconductor Manufacturing Platform for Photonics
Semiconductor Today USA Overview Aeluma Inc. has signed a Letter of Intent to receive up to $30 million in funding under the U.S. CHIPS and Science Act. This capital will support the research and development of a scalable non-indium phos... -
Dexerials Achieves 7-Year Global Market Leadership for ACF, ARF, and SVR Display Products, Crucial for AI and Autonomous Driving Advancements
Dexerials Japan Overview Dexerials announced its Anisotropic Conductive Film (ACF), Anti-reflection film (ARF), and Optical elastic resin (SVR) have maintained top global market share for seven consecutive years. ACF is essential for IC ... -
Henkel Expands Silicon Valley Application Center to Larger Site, Boosting AI & HPC Material Development in Santa Clara, CA
Henkel USA Overview Henkel has announced the expansion and relocation of its Silicon Valley Application Center for Electronics in Santa Clara, CA, to enhance customer collaboration and accelerate new product development. The upgraded fac... -
ECTC2026 Unveils Future of Semiconductor Packaging: Precision Adhesives and Low-Temperature Hybrid Bonding for HBM Integration
Tech I Japan Overview ECTC2026 highlighted critical R&D in advanced semiconductor packaging, showcasing innovations in chiplet integration, hybrid bonding, and opto-electronic convergence. Key presentations included Mitsui Chemicals ... -
Dymax Launches 9310 Dual-Cure Adhesive for High-Reliability PCB Reinforcement, Streamlining Underfill Alternatives for Advanced Electronics and AI Hardware
PR Newswire USA Overview Dymax has launched its 9310 adhesive, an innovative light and secondary heat-cure solution engineered for reinforcing fine-pitch, leadless components on printed circuit boards in advanced electronics and AI hardw... -
ACS Material Recommends ASTM D5470 for TIM Thermal Resistance Measurement, Emphasizing Separation of Bond Line and Contact Resistance for Accurate Performance Prediction
ACS Material USA Overview An ACS Material article highlights the complexity of Thermal Interface Material (TIM) performance, emphasizing that joint thermal resistance comprises both bond line and contact terms. It states that datasheet b... -
iFactory Deploys AI Vision Monitoring for Automotive Adhesive & Sealer Application, Enhancing Quality and Safety by Verifying Bead Dimensions and Continuity in Real-Time
iFactory USA Overview iFactory has implemented AI vision technology for real-time monitoring and verification of adhesive and sealer application in automotive manufacturing. This system precisely inspects the width, height, position, and... -
Delo Launches Photobond SJ4192: A Bio-Based Adhesive with 62% Renewable Content, Offering Enhanced Performance for Automotive Applications
Plastics Today Germany Overview German adhesive manufacturer Delo Industrie Klebstoffe has launched Photobond SJ4192, a bio-based adhesive containing 62% renewable raw materials, specifically for automotive applications. This multi-purpo... -
BRIJ Medical’s BRIJ-SEAL™ Advanced Wound Sealant Earns Breakthrough Technology Designation from Premier, Inc. for Enhanced Post-Operative Care
Morningstar / PR Newswire USA Overview BRIJ Medical's BRIJ-SEAL™ advanced wound sealant has received a Breakthrough Technology designation from Premier, Inc., a leading U.S. healthcare company. This innovative, single-use, sterile, and h...
