Adhesives & Sealants– category –
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Advanced AI Chips Face Intensified Thermal Management Challenges: TSMC Plans 20-Layer HBM Integration in 14x Reticle CoWoS by 2028, Microchannel Cooling Emerges as Key Technology
36Kr China Overview Thermal management has become a critical challenge in advanced-packaged AI chips, particularly due to thermal coupling issues across chiplets in 2.5D, 3D IC, CoWoS, and HBM architectures. TSMC's roadmap for 2028 inclu... -
Advanced Packaging Warpage Mitigation: Research Advances in Incorporating Negative Coefficient of Thermal Expansion Materials into Epoxy Molding Compounds and Underfills
Semiconductor Engineering USA Overview Active research is progressing on utilizing negative coefficient of thermal expansion (CTE) materials in epoxy molding compounds (EMC) and underfills to effectively mitigate warpage in large semicon... -
NIST and UCSD Develop Predictive Modeling for Cure Behavior and Thermal Endurance of Advanced Packaging Epoxy Underfills
Semiconductor Engineering USA Overview Researchers from the National Institute of Standards and Technology (NIST) and the University of California San Diego (UCSD) have published a technical paper detailing a new modeling technique to ac... -
SK Hynix Breakthrough: Mass Reflow Underfill Molding Overcomes HBM Stacking Thermal Challenges, While Micron’s Hybrid Bonding Slashes Power Consumption by 30%
CSIS USA Overview SK Hynix has established a lead in HBM chip stacking by investing heavily in 'Mass Reflow Underfill Molding' (MR-MUF), a novel packaging technique that resolves the thermal and physical constraints of multi-die HBM stac... -
Adhesives & Sealants Weekly Report September 13, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report September 13, 2026 (PDF) — Download Weekly Report September 13, 2026 (PDF) — DownloadDownload 🎙 Podcast Septe... -
Henkel Unveils New Flame-Retardant Sealant and Debonding Solutions for Rail Vehicle Lifecycle at InnoTrans 2026
Henkel Germany Overview Henkel Adhesive Technologies showcased its comprehensive portfolio for the railway industry at InnoTrans 2026, introducing solutions supporting the entire lifecycle of rail vehicles. Key launches included Teroson ... -
2026 Adhesive Industry Trends: Wash-Off/Recyclable Adhesives, Bio-Based Hot Melts, and Debond-on-Demand Solutions Driven by Right to Repair Movement
Accio Unknown Overview The adhesive industry is rapidly transitioning towards a circular economy, with 2026 key trends including wash-off/recyclable packaging adhesives and bio-based hot melts. Debond-on-Demand (DoD) industrial adhesives... -
B8X Drives Automotive Innovation with 2026 Structural Adhesives: Lightweighting, Eco-Friendly, and Self-Healing Capabilities
B8X Unknown Overview B8X announces significant innovations in structural adhesives for the 2026 automotive industry, designed to robustly bond body panels and frames, reducing vehicle weight and improving fuel efficiency. The company is ... -
Epoxy-Based Debonding-on-Demand Adhesives to Dominate EV Battery Module Market in 2026
openPR.com USA Overview This article provides an overview of a market research report on debonding-on-demand adhesives for EV battery modules. The market is expanding due to increasing pressure for battery material recovery and efficient... -
Dymax Launches BlueWave® FX Line Emitters for High-Speed UV/Visible Curing, Boosting Throughput with up to 4.2 W/cm²
Taiwan News / Dymax USA Overview Dymax has launched the new BlueWave® FX line emitter series, specifically designed for high-speed automated production environments. These 75mm and 150mm line emitters provide industry-leading intensity u...
