Adhesives & Sealants– category –
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Applied Materials Unveils Material Engineering Systems for Next-Gen AI Chips Featuring Advanced 3D Architectures
YouTube (Applied Materials channel) USA Overview Applied Materials has introduced a new suite of chipmaking systems designed to enable advanced 3D chip architectures for next-generation AI. The company is facilitating this transition thr... -
Intel Foundry Leverages U.S. Advanced Packaging (Foveros, EMIB) to Power Next-Gen AI Semiconductors
Intel Newsroom USA Overview Intel Foundry is accelerating the realization of next-generation AI semiconductors through its advanced packaging technologies developed in U.S. facilities. Utilizing Foveros stacking, EMIB silicon bridges, an... -
Electroninks and SIIX Scale Up Additive EMI Shielding Collaboration, Targeting Japan and Global Markets
EINPresswire.com USA, Japan Overview Electroninks and Japan's SIIX Corporation have expanded their strategic collaboration to advance additive electromagnetic interference (EMI) shielding solutions for diverse electronic applications, wi... -
Qnity Electronics Accelerates AI-Centric Advanced Packaging R&D with Expanded imec Collaboration
Converge Digest Belgium Overview Qnity Electronics has significantly expanded its strategic collaboration with imec, a world leader in nanoelectronics, to bolster long-term R&D in advanced semiconductor packaging crucial for AI and h... -
Matrix Adhesives Group Acquires IPS Adhesives, Expanding Portfolio in Construction and Transportation Markets
Adhesives & Sealants Industry USA Overview TruArc Partners' portfolio company, Matrix Adhesives Group, has acquired IPS Adhesives, a provider of specialized adhesives for construction, transportation, industrial, and marine industries. T... -
APPLIED Adhesives Becomes Exclusive U.S. Distributor for Henkel’s Flexible Packaging Adhesives
Adhesives & Sealants Industry USA Overview APPLIED Adhesives announced an exclusive U.S. distribution partnership with Henkel's packaging adhesives business, granting them the rights to supply Henkel's advanced adhesive and coating techn... -
GlobalFoundries Secures $300 Million CHIPS Act Award to Accelerate U.S. Silicon Photonics Leadership for AI Optical Interconnect Demand
Vermont Business Magazine USA Overview GlobalFoundries has signed a $300 million award under the U.S. CHIPS and Science Act, aimed at accelerating the nation's silicon photonics leadership. This substantial investment will support innova... -
Intel and Lens Technology Form Strategic Alliance to Accelerate Glass Substrate-Based Advanced Semiconductor Packaging for AI Era
Intel Newsroom USA Overview Intel and Lens Technology announced a strategic collaboration to accelerate the development of glass substrate-based packaging solutions for advanced semiconductors, critical for the AI era. This partnership a... -
High-Speed Hot Melt Adhesive Systems Advance Carton Sealing in Food & Beverage Packaging: Enhancing Performance & Recyclability in Harsh Environments
The National Law Review USA Overview High-speed hot melt adhesive systems are becoming indispensable in modern food and beverage packaging lines for maintaining reliable carton sealing in challenging high-humidity and low-temperature env... -
Arkema Reports Strong Q2 2026 Results with EBITDA Up 7.4% to €391 Million, Driven by Adhesive Solutions Segment
Business Wire France Overview Arkema announced robust second-quarter 2026 results, achieving an EBITDA of €391 million, a significant 7.4% increase year-on-year. This strong performance was primarily driven by the outstanding contributio...
