Key Findings
Taiyo Holdings has unveiled its “FPIM Series,” a groundbreaking next-generation semiconductor packaging material developed in collaboration with imec. This innovative material has achieved a world-first by enabling the successful formation of a three-layer Redistribution Layer (RDL) with a 700-nanometer (nm) Critical Dimension (CD) on 12-inch wafers, marking a substantial leap forward for fine-pitch wiring in advanced semiconductor packaging.
Technical / Clinical Details
- The FPIM Series is a negative-tone photosensitive insulating material specifically designed for damascene processes, which are critical for forming high-density and reliable interconnects in advanced semiconductor fabrication.
- The successful demonstration of three-layer RDL formation with a 700nm CD represents a significant technical achievement. It overcomes previous challenges in stacking multiple ultra-fine wiring layers, which is essential for meeting submicron-class RDL design rules.
- This technology is poised to accelerate the evolution of advanced packaging solutions, including flip-chip and fan-out packaging, which are indispensable for high-performance processors, AI chips, and chiplet integration in High-Performance Computing (HPC) where dense interconnections are paramount.
- The introduction of the FPIM Series is expected to drive further miniaturization, increased operating speeds, and improved power efficiency of semiconductor devices, thereby fostering innovation across diverse applications such as data centers, mobile devices, and IoT hardware.
Background & Context
As the semiconductor industry grapples with the physical limits of Moore’s Law, the focus of miniaturization and performance enhancement has increasingly shifted towards advanced packaging technologies. Within this paradigm, particularly with the rise of chiplet architectures and 3D stacking, the RDL—responsible for electrical connections between chips—has become a decisive factor for device performance. Achieving multi-layer RDLs with critical dimensions in the 700nm class has historically presented significant technical hurdles in terms of manufacturability and reliability.
The collaboration between Taiyo Holdings and imec leverages their combined expertise in cutting-edge material development and process technology, and this breakthrough is anticipated to significantly impact the semiconductor industry’s technology roadmap.
Strategic Significance & Outlook
The FPIM Series is set to contribute substantially to improving performance and reducing costs in next-generation semiconductor packaging, solidifying Taiyo Holdings’ position in the highly competitive semiconductor market. Looking forward, this technology is expected to be applied to even finer RDL pitches and more complex multi-layered structures, forming a foundational technology that supports the continued advancement of data-intensive applications like AI and HPC. It also holds significant implications for enhancing the global presence of Japanese material manufacturers within the semiconductor supply chain.
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