Adhesives & Sealants– category –
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Teroson MS 940: Henkel’s isocyanate-free adhesive specs
Henkel Adhesive Technologies Germany Overview Henkel has launched Teroson MS 940, a high-performance isocyanate-free adhesive and sealant for rail and industrial applications. This new product surpasses the mechanical performance of stan... -
Materials AI: Foundation models for clean energy challenges
AZoM (ChemRxiv preprint server) USA Overview A recent ChemRxiv preprint explores the evolution of AI in materials science, discussing the transition from narrow, task-specific machine learning models to broader foundation models applicab... -
DOWSIL TC-5533: Dow thermal gap compound vs Henkel offerings
openPR.com (Future Market Insights) USA Overview Material innovation in the thermal gap compound market focuses on developing high thermal conductivity and eco-friendly products, especially for battery pack assemblies. Dow offers DOWSIL ... -
Henkel EV Adhesives: 2026 thermal gap filler specs explained
Kings Research USA Overview Henkel launched two high thermal conductivity materials for electric vehicles (EVs) in May 2026: Bergquist TGF 2030APS thermal gap filler (1.7 W/m·K) and Loctite TLB 9270APS thermal conductive adhesive (2 W/m·... -
Birjand University: Plant nanocatalyst for water antibiotics
Tech Xplore (Birjand University of Medical Sciences) Iran Overview Researchers at Birjand University of Medical Sciences have developed a plant-based magnetic photocatalyst capable of completely removing ciprofloxacin antibiotics from wa... -
Virginia Tech: 4x stronger recyclable duct tape adhesives
Phys.org USA Overview Virginia Tech researchers have developed two innovative adhesives: one is four times stronger than commercial duct tape adhesive and degrades in minutes with weak alkaline water, while the other enables co-recycling... -
Adhesives & Sealants Weekly Report September 20, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report September 20, 2026 (PDF) — Download Weekly Report September 20, 2026 (PDF) — DownloadDownload 🎙 Podcast Septe... -
Researchers Develop Wafer-Scale Bonded Active Photonics Interposer: Pioneering Low-Loss, High-Bandwidth Optoelectronic Integration
EurekAlert! USA Overview Researchers have developed a wafer-scale bonded active photonics interposer that integrates photonic devices with electronic circuits at the wafer level, enabling low-loss, high-bandwidth communication with mass ... -
Tyndall National Institute Unveils Three Papers at ESTC 2026 Advancing Photonic Packaging and Chiplet Integration
Tyndall National Institute Ireland Overview Researchers from Tyndall National Institute presented three pivotal papers at ESTC 2026, showcasing significant innovations in photonic packaging, co-packaged optics, and chiplet integration te... -
3M Launches Cooling Film Reflecting Over 85% Solar Radiation, Cutting Vehicle Interior Temperatures by up to 10°F Without Energy Input
Simply Wall St News USA Overview 3M has introduced its 3M Cooling Film, a roof-applied heat management product for vehicles that reflects over 85% of solar radiation, reducing interior temperatures by up to 10°F (approx. 5.6°C) without c...
