Adhesives & Sealants– category –

Adsale Plastics Asia Overview Japanese chemical giants Sumitomo Chemical and Asahi Kasei are accelerating investments and innovations in semiconductor and AI materials. Sumitomo Chemical, in collaboration with Gutenberg Co., Ltd., develo...

36Kr China Overview Chinese AI new materials firm SOG Intelligence secured tens of millions of yuan in angel round financing, integrating AI computing engines for R&D focused on photoresist and semiconductor packaging adhesives. Its ...

Shanghai Metals Market (SMM) News China Overview Multiple Chinese entities have announced significant advancements in solid-state battery technology, with Sichuan University reporting ultra-high-nickel all-solid-state batteries exceeding...

▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report September 26, 2026 (PDF) — Download Weekly Report September 26, 2026 (PDF) — DownloadDownload 🎙 Podcast Septe...

3D InCites USA Overview Indium Corporation experts will present advanced materials solutions for advanced packaging, AI, and high-performance computing (HPC) at the IMAPS Symposium. Solutions include ultra-low residue flux for micro-bump...

SEMI USA Overview Four finalists from SEMI Startups for Sustainable Semiconductors presented groundbreaking innovations at SEMICON West 2026. HEXAspec Inc. achieved a 10x improvement in thermal conductivity with hBN nanosheet-polymer enc...

Brewer Science USA Overview Brewer Science will present new data at IMAPS 2026 on a high-temperature-stable laser release material, designed for advanced packaging processes from 250°C to 350°C. This material supports demanding processes...

YINCAE (via Electronics Media) USA Overview YINCAE unveiled its UV-curable underfill technologies, UF 66UV and UF 88UV, at IMAPS 2026. UF 66UV offers high-speed processing and robust reliability for advanced electronic packaging. Notably...

3D InCites Germany Overview Heraeus has unveiled a new approach to scalable silver sintering for next-generation power modules, addressing the critical challenge of balancing throughput with precision. By optimizing precise paste deposit...

Pulse 2.0 USA Overview L&L Products has introduced Toughened T-Link, an amorphous thermoplastic adhesive designed to enhance the performance of laminated epoxy carbon-fiber composites. Internal testing showed that composite panels in...