Adhesives & Sealants– category –
-
ResearchGate Paper: Semi-Interpenetrating Organogel OPSA with Reversible Hydrogen Bonding Developed for Dynamic Optical Devices
ResearchGate (Wiley - Advanced Materials Technologies) Global Overview A ResearchGate paper reports the development of semi-interpenetrating network organogel optical pressure-sensitive adhesives (OPSAs) with reversibly controlled hydrog... -
DalFort Capital Partners Closes Second Fund at $166 Million, Exceeding Hard Cap; Successfully Sells Polymer Adhesives Holdings
PR Newswire USA Overview DalFort Capital Partners announced the successful closing of its second fund at $166 million, exceeding its hard cap. Simultaneously, the firm announced the sale of Polymer Adhesives Holdings, a manufacturer of h... -
Brilliant Polymers Showcases Energy-Efficient, VOC-Free Solvent-Free Adhesives for Flexible Packaging at Interpack
Packaging South Asia India Overview Brilliant Polymers showcased its latest solvent-free adhesive technologies for flexible packaging at Interpack 2026. These next-generation laminating adhesives are designed for high-speed lamination en... -
PatSnap Eureka Report: UV-Curable Adhesives Achieve Ultra-Fast Curing (2-3 seconds) for Accelerated Chip Embedding in Semiconductor Manufacturing
PatSnap Eureka Global Overview A PatSnap Eureka report reveals the semiconductor industry's increasing adoption of UV-curable adhesives for chip embedding due to their rapid curing capabilities and advantages in precision manufacturing. ... -
PatSnap Eureka Report: Reducing Voiding in Chip Embedding Epoxies Critical for High-Reliability Systems in Automotive and Aerospace
PatSnap Eureka Global Overview A PatSnap Eureka report identifies reducing voiding in chip embedding epoxies as a critical reliability challenge in high-performance electronic packaging, particularly for automotive and aerospace systems.... -
Sumitomo Bakelite Develops G785 Series High-Tg Epoxy Molding Compounds with Industry-Leading 230°C Tg for Next-Gen SiC Power Modules
Sumitomo Bakelite Co., Ltd. Japan Overview Sumitomo Bakelite has developed the 'G785 Series' of high-Tg epoxy molding compounds for next-generation SiC power modules, achieving an industry-leading glass transition temperature (Tg) of 230... -
Alliance Chemical Report: Advanced Talc Applications Crucial for EV Battery Thermal Management and Power Electronics Reliability
Alliance Chemical USA Overview An Alliance Chemical report highlights that engineered talc grades are becoming critical in high-tech manufacturing, including EV battery thermal management and power electronics. In epoxy molding compounds... -
Henkel Adhesives Innovates Advanced Semiconductor Packaging Materials for High-Performance Computing and Generative AI
Henkel Adhesives Germany Overview Henkel is developing innovative material solutions for advanced semiconductor packaging, addressing demands for higher performance, greater integration, and improved efficiency in a rapidly evolving tech... -
Ammega Expands Georgia Facility for World’s First Water-Based Polyurethane Belt Production, Driving Sustainability and VOC Reduction
The National Provisioner USA Overview Ammega Group has expanded its Georgia facility to exclusively produce water-based polyurethane (PU) belts, becoming its first global site to do so. This innovation significantly reduces atmospheric p... -
Henkel Agrees to Acquire OLAPLEX for $1.4 Billion, Strengthening Position in Prestige Beauty Market
DelMorgan & Co. Germany Overview Henkel announced its plan to acquire OLAPLEX for approximately $1.4 billion, reflecting ongoing consolidation in the beauty and personal care sector. Henkel, a company with operations spanning adhesives, ...
