Adhesives & Sealants– category –
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Electroninks and SIIX Scale Up Additive EMI Shielding Collaboration, Targeting Japan and Global Markets
EINPresswire.com USA, Japan Overview Electroninks and Japan's SIIX Corporation have expanded their strategic collaboration to advance additive electromagnetic interference (EMI) shielding solutions for diverse electronic applications, wi... -
Qnity Electronics Accelerates AI-Centric Advanced Packaging R&D with Expanded imec Collaboration
Converge Digest Belgium Overview Qnity Electronics has significantly expanded its strategic collaboration with imec, a world leader in nanoelectronics, to bolster long-term R&D in advanced semiconductor packaging crucial for AI and h... -
Matrix Adhesives Group Acquires IPS Adhesives, Expanding Portfolio in Construction and Transportation Markets
Adhesives & Sealants Industry USA Overview TruArc Partners' portfolio company, Matrix Adhesives Group, has acquired IPS Adhesives, a provider of specialized adhesives for construction, transportation, industrial, and marine industries. T... -
APPLIED Adhesives Becomes Exclusive U.S. Distributor for Henkel’s Flexible Packaging Adhesives
Adhesives & Sealants Industry USA Overview APPLIED Adhesives announced an exclusive U.S. distribution partnership with Henkel's packaging adhesives business, granting them the rights to supply Henkel's advanced adhesive and coating techn... -
GlobalFoundries Secures $300 Million CHIPS Act Award to Accelerate U.S. Silicon Photonics Leadership for AI Optical Interconnect Demand
Vermont Business Magazine USA Overview GlobalFoundries has signed a $300 million award under the U.S. CHIPS and Science Act, aimed at accelerating the nation's silicon photonics leadership. This substantial investment will support innova... -
Intel and Lens Technology Form Strategic Alliance to Accelerate Glass Substrate-Based Advanced Semiconductor Packaging for AI Era
Intel Newsroom USA Overview Intel and Lens Technology announced a strategic collaboration to accelerate the development of glass substrate-based packaging solutions for advanced semiconductors, critical for the AI era. This partnership a... -
High-Speed Hot Melt Adhesive Systems Advance Carton Sealing in Food & Beverage Packaging: Enhancing Performance & Recyclability in Harsh Environments
The National Law Review USA Overview High-speed hot melt adhesive systems are becoming indispensable in modern food and beverage packaging lines for maintaining reliable carton sealing in challenging high-humidity and low-temperature env... -
Arkema Reports Strong Q2 2026 Results with EBITDA Up 7.4% to €391 Million, Driven by Adhesive Solutions Segment
Business Wire France Overview Arkema announced robust second-quarter 2026 results, achieving an EBITDA of €391 million, a significant 7.4% increase year-on-year. This strong performance was primarily driven by the outstanding contributio... -
Adhesives Identified as Key Input for Composite Can Manufacturing Plants as Demand Rises for Eco-Friendly Packaging
openPR.com International Overview Demand for composite cans is rapidly increasing in the food, beverage, and consumer goods industries due to their eco-friendly properties and versatility. These cans, made from multi-layered structures o... -
Aeluma Secures $30 Million US CHIPS Act Funding to Advance Scalable Non-InP Semiconductor Manufacturing Platform for Photonics
Semiconductor Today USA Overview Aeluma Inc. has signed a Letter of Intent to receive up to $30 million in funding under the U.S. CHIPS and Science Act. This capital will support the research and development of a scalable non-indium phos...
