Adhesives & Sealants– category –
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PatSnap Eureka Report: Optimizing Adhesive Coverage to Reduce Cell Delamination Risks in Advanced Packaging and Flexible Displays
PatSnap Eureka Global Overview A PatSnap Eureka report highlights the critical need for improved adhesive technologies and optimized coverage to prevent cell delamination in advanced semiconductor packaging and flexible display sectors. ... -
QinanX New Material Offers Fast-Curing, High-Clarity, Low-Shrinkage UV-Curable Adhesives for Electronics, Optics, and Medical Industries
QinanX New Material China Overview QinanX New Material provides UV-curable adhesives that cure in seconds under UV light for a wide range of applications, including electronics, optical lenses, displays, medical devices, and glass/plasti... -
Arkema Unveils Next-Gen Material Solutions for EV Batteries at Battery Show Europe 2026, Enhancing Adhesion, Energy Density, and Recyclability
Arkema France Overview Arkema showcased integrated material solutions for EV and energy storage system battery packs at The Battery Show Europe 2026, focusing on improved adhesion, energy density, safety, and recyclability. Key innovatio... -
PatSnap Eureka Report: Advanced Adhesive Formulations Critical for Preventing Thermal Runaway in EV and Energy Storage Systems
PatSnap Eureka Global Overview A new PatSnap Eureka report highlights the essential role of advanced adhesive formulations in preventing or mitigating thermal runaway in energy storage systems. Research focuses on developing materials wi... -
Dow Launches DOWSIL TC-3120 Thermal Gel with 12 W/m·K Conductivity for AI Networking and 800G/1.6T Optical Modules
Lightwave USA Overview Dow has introduced DOWSIL TC-3120 Thermal Gel, a new silicone-based thermal interface material (TIM) designed for high-speed networking equipment, optical modules, and other electronics facing intense thermal-manag... -
Adhesives & Sealants Weekly Report May 31, 2026
📄 Weekly Report May 31, 2026 (PDF) — Download Weekly Report May 31, 2026 (PDF) — DownloadDownload 🎙 Podcast May 31, 2026 (MP3) — Play & Download Adhesives_SealantsEnglishPodcast_20260531.mp3Download -
Samsung and Intel Pioneer Low-Warpage Solutions for Advanced Electronics Packaging, Boosting Reliability
PatSnap Eureka Global Overview Samsung and Intel are spearheading efforts to reduce warpage in electronics packaging components. Samsung leverages its I-Cube technology and optimized package stack designs to match thermal expansion chara... -
Advanced Spray Adhesives Reshape Industrial Manufacturing with Focus on Sustainability and High Performance
SNS Insider Global Overview The spray adhesive market is projected to grow, driven by demands from construction, automotive, and packaging industries for high-performance bonding solutions. Huntsman, a key supplier of specialty chemicals... -
Techinno Redefines AI Thermal Management with 16W/m·K Silicone-Free Gap Pad
Techinno (泰吉诺) China Overview Techinno has launched 'Fill-Pad US 1600,' an advanced silicone-free thermal gap pad specifically designed to combat the severe thermal challenges in high-density AI data centers. Featuring an industry-lea... -
Kingfa Advances Low-Stress Crystallization Techniques for Mold Compounds, Mitigating Warpage in Advanced Packaging
Global Semiconductor Global Overview Advanced mold compounds face challenges like package warpage, delamination, and mechanical property degradation due to inherent stresses during crystallization. Kingfa adopts advanced nucleation syste...
