Adhesives & Sealants– category –
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ACS Nano Reports Isotropically Ultrahigh Thermal Conductive Boron Nitride/Polymer Composites, Revolutionizing AI Chip Cooling
ACS Nano USA Overview A breakthrough study published in ACS Nano presents a boron nitride (BN)/polymer composite with a biaxially oriented thermal conductive network, achieving isotropically ultrahigh thermal conductivity for advanced el... -
University of Tokyo Develops CyclicFP-fmoc, a Reversible Adhesive with Strong, Flexible Bonding to Untreated Teflon, Enabling Full Recycling via Ethanol Dissolution
Assembly Magazine Japan Overview Researchers at the University of Tokyo have developed CyclicFP-fmoc, a novel reversible adhesive that forms strong, flexible bonds to untreated Teflon (PTFE) and other fluoroplastics through non-covalent ... -
Exponential Relationship Between Underfill Adhesive Curing and Shear Strength Unveiled for Flip-Chip Micro-interconnections
springerprofessional.de Germany Overview A new study systematically investigated epoxy-based underfill adhesives in flip-chip packaging, establishing an exponential relationship between the degree of curing and shear strength. Researcher... -
Sheen Technology Details Evolving TIM Requirements for AI Chips, Emphasizing High Thermal Conductivity and Low Thermal Resistance for Liquid Cooling
Sheen Technology Taiwan Overview Sheen Technology has published a comprehensive guide outlining the evolving requirements for Thermal Interface Materials (TIMs) in high-performance AI chips. Driven by advanced packaging such as 2.5D/3D s... -
Chiplet Underfill Dispensing Market to Grow Through 2036 Driven by HBM and C2W Hybrid Bonding Void Reduction Needs
Fact.MR USA Overview This article summarizes a market research report from Fact.MR. The chiplet underfill dispensing market is growing, driven by the need for wafer-level underfill in HBM manufacturing and tailored viscosity/cure profile... -
GM Mandates Specialized Adhesives for Corvette C8 Repairs, Signaling Industry Shift in Advanced Material Maintenance
Automobile Repair News USA Overview General Motors has issued a stringent directive requiring specific, validated adhesives for the Corvette C8's rear impact bar replacement, including specialized formulas for aluminum, Sheet Molding Com... -
SK Hynix to Launch Advanced Packaging Plant in Indiana, USA by H2 2028 to Meet Surging HBM3 Demand
BigGo Finance South Korea Overview SK hynix is driving aggressive capacity expansion to meet the surging demand for High Bandwidth Memory 3 (HBM3). The company plans to begin operations at an advanced packaging plant in Indiana, USA, by ... -
Silicone Foam for Lithium Battery Packs Market to Grow Through 2035, Driven by Thermal Runaway Regulations; EV Batteries Lead End-Use
IndexBox Unknown Overview This article outlines a market research report from IndexBox, projecting the silicone foam market for lithium battery pack assemblies to grow through 2035 due to escalating thermal runaway regulations. Electric ... -
Intel Seeks Senior Module Test Engineer in Kulim, Malaysia to Advance CUF Module Improvement and New Material Application for Advanced Packaging
Jooble USA Overview Intel is recruiting a Senior Module Test Engineer in Kulim, Malaysia, to lead the design and development of advanced manufacturing test processes. This role supports post-packaging burn-in, final test, and system test... -
AtlasPCB Releases BGA Underfill Selection Guide Comparing Capillary Flow and Reworkable Formulations for Automotive, Aerospace
AtlasPCB Unknown Overview AtlasPCB has published a BGA (Ball Grid Array) underfill selection guide as part of its PCB engineering insights blog series. The article comprehensively compares capillary flow, molded underfills, and reworkabl...
