This article provides an overview of a market research report published by Fact.MR. The chiplet underfill dispensing market is projected for continuous growth through 2036, driven by advancements in high-performance semiconductor packaging, particularly High Bandwidth Memory (HBM) and chip-to-wafer (C2W) hybrid bonding.
Report Overview
The report focuses on the impact of chiplet technology advancements on the underfill dispensing market. It highlights the criticality of wafer-level underfill in HBM manufacturing and the reduction of voids in C2W hybrid bonding as key challenges. To address these, there is a growing demand in the market for adhesives with precisely tuned viscosity and cure profiles. The report also details the proactive efforts of OSAT (Outsourced Semiconductor Assembly and Test) providers in qualifying underfill materials and dispensing recipes to meet various die sizes, substrate finishes, and stringent customer reliability requirements.
Key Findings
- Market growth is propelled by the need for wafer-level underfill in HBM manufacturing and void reduction in C2W hybrid bonding.
- Precisely tuned viscosity and cure profile underfill adhesives are essential for enhancing the reliability of high-performance packaging.
- OSAT providers are actively qualifying underfill materials and dispensing recipes to accommodate diverse semiconductor devices and process requirements.
- While capillary underfill remains the benchmark process for thermomechanical stress protection, wafer-level underfill lamination and non-conductive films (NCFs) are emerging as critical technologies to resolve bottlenecks for fine bump pitches below 40 µm.
About the Publisher
Fact.MR is a global market research company that provides deep market insights and detailed analysis across a wide range of industrial sectors. Their reports aim to provide actionable information on market size, trends, competitive analysis, and growth opportunities, helping companies make strategic decisions.
Source: https://www.factmr.com/report/chiplet-underfill-dispensing-market
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