Market Trends– category –
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NASA’s Artemis Program Targets Multiple Missions Post-2027 for Lunar Base Construction by 2032
ShareAmerica USA Overview NASA's Artemis program outlines an ambitious plan to establish a human lunar outpost by 2032, with Artemis III scheduled for 2027 and Artemis IV in 2028 to achieve sustained lunar presence. These missions will d... -
SK hynix’s Early Strategic Investment in AI and HBM Drives Market Value Lead Over Samsung, Bolstering Production Capacity for NVIDIA Demand
Reuters South Korea Overview SK hynix's early and aggressive investment in HBM (High Bandwidth Memory) technology and significant capacity expansion, anticipating future NVIDIA demand, has allowed it to differentiate from Samsung Electro... -
BE Semiconductor Industries (BESI) Raises Long-Term Revenue Target to €2.2 Billion and Operating Margin Target to 45% Amid Surging Hybrid Bonding Demand
Bits&Chips Netherlands Overview BE Semiconductor Industries (BESI) has significantly raised its long-term annual revenue target from €1.5-1.9 billion to €1.7-2.2 billion, while also increasing the lower end of its operating margin target... -
OSAT Vendors Report Strong Q1 2026 Revenue Growth Driven by AI-Related Advanced Packaging Demand: ASE Up 18%, Amkor Up 25%
Counterpoint Research Global Overview The Outsourced Semiconductor Assembly and Test (OSAT) sector recorded robust revenue growth in Q1 2026, fueled by surging AI-driven advanced packaging demand. ASE Technology Holding reported an 18% y... -
Singapore’s Exports Soar to 22-Year High in May 2026, Driven by AI Semiconductor Supply Chain Contributions from Micron’s HBM Packaging and UMC’s 22nm Production
FSMOne Singapore Overview Singapore's non-oil domestic exports (NODX) recorded their highest growth in 22 years in May 2026, primarily due to the nation's deep integration into the AI semiconductor supply chain. Micron Technology's HBM a... -
ASE Technology Holding Accelerates AI Chip Production with Major Packaging Expansion, Raises 2026 LEAP Revenue Target to Over $3.5 Billion
Crypto Briefing Taiwan Overview ASE Technology Holding is embarking on a significant global expansion, including 15 new facilities, to address the escalating demand for AI chips. This strategic move, leveraging their LEAP platform and VI... -
Hanmi Semiconductor Secures ₩44.2 Billion SK hynix Order for HBM4 TC Bonders, Signaling Robust Advanced Packaging Equipment Market Growth
HTX South Korea Overview Hanmi Semiconductor has received a significant ₩44.2 billion (approx. $32 million) order from SK hynix for its TC Bonder 4.5 Griffin, crucial for next-generation HBM4 production, with delivery slated for early Se... -
Morgan Stanley Raises CoWoS Demand Forecast to 2.69 Million Wafers by 2027, Citing CPUs and ASICs as New Drivers
Industry Analysis / Moomoo Unknown Overview Morgan Stanley has significantly raised its demand forecast for TSMC's CoWoS packaging, projecting it to reach 2.69 million wafers annually by 2027. CPUs and ASICs are emerging as new key drive... -
Malaysia Invests RM185 Million ($40M) in Advanced Semiconductor R&D Initiative, Targeting 7% Global Packaging Market Share with HBM4 Test Chip Development
Malay Mail / Digital News Asia Malaysia Overview Malaysia's Ministry of Science, Technology and Innovation (Mosti) has launched a RM185 million (approx. $40 million USD) Research, Development, Innovation, Commercialization, and Economy (... -
Morgan Stanley: TSMC AI Revenue to Triple by 2027, CoWoS Packaging Remains Critical Bottleneck
HTX Insights (Morgan Stanleyレポート引用) International Overview A new report from Morgan Stanley forecasts TSMC's AI-related revenue to surge by 218% to $86.3 billion by 2027, up from $27.1 billion in 2026. However, this explosive growt...
