Market Trends– category –
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LandSpace’s Zhuque-3 Achieves Historic Methane-Fueled Rocket Landing, Propelling China into Reusability Elite
China Science and Technology Network China Overview On August 19, 2026, China's LandSpace Technology Co., Ltd. successfully achieved the land-based recovery of the first stage of its methane-fueled Zhuque-3 reusable rocket. This landmark... -
NASA’s Artemis III Human Lunar Landing Mission Redefined for 2027 Earth Orbit Rehearsal; Lunar Landing Postponed to Artemis IV in 2028
Britannica USA Overview NASA's Artemis III mission has been redefined to a low-Earth orbit lander rehearsal in 2027, postponing the human lunar landing to Artemis IV in 2028 due to delays in deep space landing technology development. Thi... -
City Labs Successfully Launches World’s First Commercial Nuclear-Powered Satellite on SpaceX Falcon 9, Achieving Solar-Independent Power with Tritium Betavoltaic Battery
Wall Street Endeavor USA Overview City Labs has successfully launched the world's first commercial nuclear-powered satellite on a SpaceX Falcon 9 rideshare mission, featuring compact betavoltaic batteries powered by tritium decay. This g... -
Korea and Taiwan Surge as Semiconductor Equipment Investment Hubs, Driven by HBM and Advanced Packaging in H1 2026
The Information Network USA, South Korea, Taiwan Overview In the first half of 2026, global semiconductor equipment sales witnessed a significant geographical pivot, with South Korea (up 32.4%) and Taiwan (up 24.0%) emerging as primary g... -
South Korea Accelerates Advanced Packaging Investments, Establishing Itself as Core of Global AI Semiconductor Supply Chain
Investment Monitor South Korea, USA Overview South Korea is significantly boosting its advanced packaging investments to meet surging AI semiconductor export demand. SK Hynix plans to complete a ₩19 trillion ($12.9 billion) advanced pack... -
Applied Materials Forecasts Over 70% Growth in Advanced Packaging Revenue, Total Revenue Up 40%, Driven by AI and HBM Demand
TradingKey USA Overview Applied Materials projects approximately 40% growth in its total revenue for 2026, benefiting significantly from the increasing complexity in AI chip and HBM manufacturing. The company anticipates over 70% growth ... -
Onto Innovation’s Advanced Packaging Business Achieves 80% Growth, Driven by Dragonfly G5 for HBM4 and 2.5D AI
Investing.com USA Overview Onto Innovation announced its advanced packaging business grew by 80% year-over-year in 2026, fueled by robust demand from HBM and 2.5D logic applications. The company's Dragonfly G5 platform has been adopted f... -
KLA Achieves $1.1 Billion in Advanced Packaging Process Control Revenue, Driven by Surging AI Chip Demand
Quartz USA Overview KLA projects approximately $1.1 billion in revenue from its advanced packaging process control systems in 2026, marking over 70% year-over-year growth, driven by the increasing complexity of AI and HPC chips. The shif... -
High-End ABF Substrate Supply Faces Critical Shortage Amid Gigantic AI Chip Growth, Fueling Intense Competition Among Taiwanese Manufacturers
Tom's Hardware Taiwan Overview The escalating computational power and physical size of AI chips have led to a severe global shortage in the supply of high-end Ajinomoto Build-up Film (ABF) substrates, a core component. In response, inten... -
NXP Unveils Plan to More Than Double Malaysian Semiconductor Back-End Capacity Amid Surging Global Demand
Japanese Semiconductor Manufacturing Equipment Malaysia Overview NXP has announced a substantial expansion of its Malaysian facility, targeting a more than twofold increase in semiconductor back-end production capacity. This strategic in...
