Market Trends– category –
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ASMPT’s Advanced Packaging Business Achieves Record H1 2026 Sales Driven by Surging AI Demand; Panel-Level Packaging Positioned as Key Future Growth Driver
ASMPT Corporate (Press Release) Hong Kong Overview ASMPT reported robust interim results for H1 2026, with its Advanced Packaging (AP) business achieving record sales, primarily fueled by the accelerating demand from the AI sector. The c... -
U.S. Commerce Department to Invest Up to $874 Million in Seven Semiconductor Companies Across AI, Advanced Packaging, and Supply Chain Security
AnySilicon USA Overview The U.S. Department of Commerce announced its intent to provide up to $874 million in incentives to seven semiconductor technology companies, targeting critical areas such as AI, advanced computing, semiconductor ... -
Applied Materials Significantly Upscales 2026 Advanced Packaging Growth Forecast to Over 70% as AI Chip Investment Shifts to HBM and Multi-Layer Integration
Xenospectrum USA Overview Applied Materials has substantially elevated its 2026 advanced packaging revenue growth forecast to over 70%, a 20-point jump from its previous 50%+ projection. This revision reflects a critical expansion of AI ... -
Samsung Electro-Mechanics Sees Semiconductor Package Substrate Utilization Rate Soar to 89%, Driven by AI Data Center Demand
연합뉴스 (Yonhap News) South Korea Overview Samsung Electro-Mechanics reported a significant increase in its semiconductor package substrate utilization rate, reaching an average of 89% in the first half of the year—a 19 percentage point... -
HBM Supply Crunch: Long Backlogs for Bonding Equipment and Low Yields Create Bottleneck, Constraining AI Demand Until 2027
AI CERTs News USA Overview HBM stack manufacturing demands Through Silicon Vias (TSV) and high-precision bonding equipment, with low yield tolerance posing an industry challenge. Limited vendors for these specialized tools mean HANMI, a ... -
Bonafide Research: Global 3D/2.5D IC Packaging Market Accelerates with UCIe Standard, Forecasts Growth Through 2031
Bonafide Research India Overview This article provides an overview of a market research report published by Bonafide Research. According to Bonafide Research's latest report, the global 3D IC and 2.5D IC packaging market is projected to ... -
HBM Supply Crisis of 2026 Projected to Persist Until 2027, Redefining AI Hardware Deployment Bottleneck
EnkiAI USA Overview Explosive growth in the AI sector has triggered a structural HBM supply crisis, making it the primary bottleneck for AI hardware deployment throughout 2026, projected to last until at least 2027. The market has shifte... -
2026 Chip Crisis Sounds Hardware Wake-Up Call: AI Demand Reshaping Semiconductor Supply Chains
Trax Technologies USA Overview The 2026 chip crisis highlighted modern supply chains' deep reliance on semiconductor availability, where chip access dictates the viability and growth of AI accelerators, warehouse robots, autonomous vehic... -
Samsung HBM4 Yield Dramatically Improves from Under 60% to 80%; SK Hynix Labor Talks Stall, Intensifying AI Memory Race
TrendForce Taiwan Overview Samsung's HBM4 yield has dramatically improved from under 60% at launch to 80% within months, according to Seoul Economic Daily. This swift process enhancement by Samsung comes amid tight HBM supply, surpassing... -
SK Hynix Poised to Dominate HBM4 Market with 70% Price Hike and $7B Global Investment for AI Acceleration
SK Hynix South Korea Overview SK Hynix, commanding over 60% of the high-bandwidth memory (HBM) market, projects a nearly 70% price increase for its next-generation HBM4, slated for 2026. To meet soaring AI demand, the company is committi...
