New Technology– category –
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Rice University Chemists Engineer Novel Interaction Between Neodymium and Oxygen Using “Basket” Molecular Structures
ScienceDaily USA Overview Chemists at Rice University have developed an innovative method to induce novel interactions between the rare-earth metal neodymium and oxygen. By designing specialized "basket" molecular structures, they precis... -
CuspAI Secures $580M to Accelerate AI-Driven Materials Discovery Platform
AlleyWatch UK Overview Cambridge-based startup CuspAI has raised a substantial $580 million from investors including Temasek, Lightspeed Venture Partners, and Samsung Electronics. CuspAI's platform functions as a structured search engine... -
Future of Lightweight Components in Aerospace and Automotive Driven by Composites and Advanced Polymers
JULI Adhesives & Sealants Global Overview The future of lightweight components in the aerospace and automotive industries is being shaped by the maturation of composite materials, advanced polymers, and digital manufacturing technologies... -
Applied Materials Unveils Material Engineering Systems for Next-Gen AI Chips Featuring Advanced 3D Architectures
YouTube (Applied Materials channel) USA Overview Applied Materials has introduced a new suite of chipmaking systems designed to enable advanced 3D chip architectures for next-generation AI. The company is facilitating this transition thr... -
Intel Foundry Leverages U.S. Advanced Packaging (Foveros, EMIB) to Power Next-Gen AI Semiconductors
Intel Newsroom USA Overview Intel Foundry is accelerating the realization of next-generation AI semiconductors through its advanced packaging technologies developed in U.S. facilities. Utilizing Foveros stacking, EMIB silicon bridges, an... -
Qnity Electronics Accelerates AI-Centric Advanced Packaging R&D with Expanded imec Collaboration
Converge Digest Belgium Overview Qnity Electronics has significantly expanded its strategic collaboration with imec, a world leader in nanoelectronics, to bolster long-term R&D in advanced semiconductor packaging crucial for AI and h... -
Intel and Lens Technology Form Strategic Alliance to Accelerate Glass Substrate-Based Advanced Semiconductor Packaging for AI Era
Intel Newsroom USA Overview Intel and Lens Technology announced a strategic collaboration to accelerate the development of glass substrate-based packaging solutions for advanced semiconductors, critical for the AI era. This partnership a... -
High-Speed Hot Melt Adhesive Systems Advance Carton Sealing in Food & Beverage Packaging: Enhancing Performance & Recyclability in Harsh Environments
The National Law Review USA Overview High-speed hot melt adhesive systems are becoming indispensable in modern food and beverage packaging lines for maintaining reliable carton sealing in challenging high-humidity and low-temperature env... -
Aeluma Secures $30 Million US CHIPS Act Funding to Advance Scalable Non-InP Semiconductor Manufacturing Platform for Photonics
Semiconductor Today USA Overview Aeluma Inc. has signed a Letter of Intent to receive up to $30 million in funding under the U.S. CHIPS and Science Act. This capital will support the research and development of a scalable non-indium phos... -
Henkel Expands Silicon Valley Application Center to Larger Site, Boosting AI & HPC Material Development in Santa Clara, CA
Henkel USA Overview Henkel has announced the expansion and relocation of its Silicon Valley Application Center for Electronics in Santa Clara, CA, to enhance customer collaboration and accelerate new product development. The upgraded fac...
