New Technology– category –
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Exponential Relationship Between Underfill Adhesive Curing and Shear Strength Unveiled for Flip-Chip Micro-interconnections
springerprofessional.de Germany Overview A new study systematically investigated epoxy-based underfill adhesives in flip-chip packaging, establishing an exponential relationship between the degree of curing and shear strength. Researcher... -
Sheen Technology Details Evolving TIM Requirements for AI Chips, Emphasizing High Thermal Conductivity and Low Thermal Resistance for Liquid Cooling
Sheen Technology Taiwan Overview Sheen Technology has published a comprehensive guide outlining the evolving requirements for Thermal Interface Materials (TIMs) in high-performance AI chips. Driven by advanced packaging such as 2.5D/3D s... -
Redwire Opens State-of-the-Art Space-Enabled R&D and Manufacturing Facility, Accelerating Space Industry Production Capabilities
Building Indiana Business USA Overview Redwire has inaugurated a state-of-the-art facility to accelerate space-enabled research and development and manufacturing. This facility will support a diverse range of in-space applications, inclu... -
Northrop Grumman Launches Mission Robotic Vehicle (MRV) for On-Orbit Satellite Servicing, Featuring MEP and PRM Capabilities
Apogee Magazine USA Overview Northrop Grumman has launched the autonomous Mission Robotic Vehicle (MRV), designed for on-orbit satellite servicing missions. Equipped with robotic arms and specialized tools, the MRV will provide diverse s... -
Caltech and Sophia Space Patent Passive Cooling System for Orbital Data Centers, with Sales Aimed for 2028
The Star USA Overview Caltech and orbital space computing startup Sophia Space have secured a patent for an innovative cooling system tailored for orbital data centers. This system employs a tile-based modular architecture, achieving pas... -
NASA’s CAPSTONE 02 Mission to Demonstrate Autonomous Navigation and Communication Technologies in Lunar Orbit by 2027, Supporting Artemis Program
NASA USA Overview NASA announced the CAPSTONE 02 mission, slated for launch in 2027, will demonstrate advanced technologies in cislunar space, including rendezvous and proximity operations, autonomous navigation, and cislunar communicati... -
China Successfully Completes World’s First On-Orbit Test of 400V Space Power System on Tianzhou-10
Global Times China Overview China successfully completed all on-orbit tests of its new-generation space power system aboard the Tianzhou-10 cargo spacecraft, marking the world's first application of a 400V bus power system in orbit. This... -
Intel Unveils “Starfire”: First Space-Grade Processor Integrating AI Acceleration and Radiation Hardening
Semiconductor Engineering USA Overview Intel announced "Starfire" in July 2026, its inaugural processor designed for space, combining cutting-edge AI acceleration with robust radiation hardening. This system-on-chip is built on Intel's a... -
South Korea’s KERI Demonstrates SiC-Based Betavoltaic Battery Capable of 50+ Years Operation, a Global First
EurekAlert! South Korea Overview The Korean Electrotechnology Research Institute (KERI) has successfully demonstrated the nation's first SiC-based betavoltaic battery capable of supplying stable power for over 50 years without recharging... -
Sora Aviation and Toray Advanced Composites Partner for eVTOL Aircraft Production, Elevating S-1 Performance with Advanced Composites
AIN International Overview Sora Aviation and Toray Advanced Composites have signed an MOU for the production of the Sora S-1 eVTOL aircraft, integrating advanced carbon fiber composites throughout its airframe and propeller blades. This ...
