New Technology– category –
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NASA Begins Major Assembly for Dragonfly Nuclear-Powered Drone Mission to Saturn’s Moon Titan
Space Daily USA Overview NASA has commenced the major assembly of Dragonfly, a nuclear-powered drone designed to explore Titan, Saturn’s largest moon. Slated for a SpaceX Falcon Heavy launch after July 2028 and arrival in late 2034, Drag... -
China Successfully Launches Tianlian-2 06 Data Relay Satellite on Long March 3B Rocket, Withstanding Lightning Strike
India Today India Overview China successfully launched the Tianlian-2 06 data relay satellite using a Long March 3B rocket from Xichang Satellite Launch Center on July 23, 2026. Remarkably, the rocket endured a lightning strike just seco... -
Glass Bubbles for Spacecraft Thermal Protection Systems Dramatically Improve Lightweight Composites and Insulation Performance
Glass-Bubble.com International Overview Glass bubbles (hollow microspheres) are gaining significant attention as a critical material for spacecraft Thermal Protection Systems (TPS), demonstrating remarkable improvements in lightweight co... -
Northrop Grumman Launches Robotic Space Vehicle for On-Orbit Servicing: Extending Satellite Lifespans and Enhancing Operational Flexibility
Military & Aerospace Electronics USA Overview Northrop Grumman has successfully launched a Mission Robotic Vehicle (MRV) and three Mission Extension Pods (MEPs) designed to autonomously repair, inspect, relocate, and extend the lifespan ... -
Space Oncology Emerges as New Frontier: Revolutionizing Cancer Research and Drug Discovery in Microgravity
Drishti IAS India Overview Space oncology is rapidly emerging as a new research frontier, investigating how microgravity and space radiation influence cancer progression, tumor modeling, drug discovery, and treatment response. The unique... -
NASA Astronaut Concludes ISS Mission, Reports Breakthrough in Microgravity Protein and Semiconductor Crystal Growth
NASA USA Overview NASA astronaut Chris Williams has completed his International Space Station (ISS) mission, reporting successful growth of high-quality protein and semiconductor crystals in microgravity. These space-grown crystals exhib... -
SiC Power Modules Get a Boost: Advanced Packaging with AMB and Embedded Die Transforms EV and AI Data Centers
[Industry Publication/Research] Global Overview Advanced packaging technologies for Silicon Carbide (SiC) power modules are dramatically improving thermal management and power density in electric vehicle (EV) inverters and AI data center... -
2.5D Packaging and HBM Integration Accelerate for AI Accelerators: TSMC CoWoS and Samsung I-CubeS Drive Towards 5.5x Reticle Sizes by 2026
Econ Market Research Global Overview The adoption of HBM-integrated 2.5D packaging for AI accelerators is rapidly expanding, with TSMC and Samsung spearheading the technological advancements. TSMC's CoWoS platform now supports silicon in... -
Intel Accelerates Next-Gen AI Semiconductor Development in U.S. Fabs with Foveros and Enhanced EMIB-T Packaging
Intel USA Overview Intel is aggressively advancing next-generation AI semiconductor development in its U.S. fabs by leveraging cutting-edge advanced packaging technologies such as Foveros stacking, EMIB silicon bridges, and particularly ... -
Intel’s EMIB Dominates AI Packaging with Google Adoption, Prompting TSMC to Develop Similar Tech Amidst CoWoS Constraints
Benzinga USA Overview Intel's EMIB technology is establishing a significant competitive advantage in advanced chip packaging for AI workloads, exemplified by Google's adoption of EMIB-T in its 9th-generation TPUs. Facing CoWoS capacity f...
