New Technology– category –
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Sn-Coated Cu Solder Paste via Transient Liquid Phase Bonding Offers High-Reliability for Power Device Packaging
MDPI Switzerland Overview This MDPI paper reports on the potential of Sn-coated Cu solder paste for power device packaging using Transient Liquid Phase Bonding (TLPB). While Cu offers excellent electrical and thermal conductivity, its ox... -
Talc’s Multifunctional Role: Enhancing Performance in EV Batteries and Power Electronics
Alliance Chemical USA Overview Talc plays a crucial role in advanced technologies from EV batteries to power electronics. Talc-filled silicone or polyurethane gap pads serve as thermal interface materials in EV battery modules, providing... -
Henkel Delivers Comprehensive Adhesion & Sealing Solutions for Advancing E-Mobility Battery Systems
Henkel Adhesives Germany Overview Henkel offers a comprehensive suite of solutions for e-mobility, including adhesives, thermal adhesives, and safety potting compounds for EV battery systems. These materials are engineered to enable cost... -
Nora Systems’ noraplan® nTx Rubber Flooring Halves Installation Time with Integrated Self-Adhesive Technology
Continental Flooring Company USA Overview Nora Systems, Inc. has launched noraplan® nTx, a revolutionary sheet rubber flooring that cuts installation time by up to 50%. This next-generation product features a pre-applied, solvent-free se... -
Arctic Unveils TP-4 Premium Thermal Pads: Setting New Standards for Electronic Component Cooling
TechPowerUp Switzerland Overview Arctic has launched the TP-4 series, a new line of high-performance thermal pads engineered for efficient heat transfer and robust component protection across diverse electronic hardware. Designed for RAM... -
Novel Silicone-Free Hybrid TIM Achieves Stable Low Thermal Resistance Under Harsh Conditions for Power Modules
PatSnap Eureka USA Overview Research from PatSnap Eureka reports on a novel thermal interface material (TIM) optimized for power modules operating under harsh temperature and humidity. The proposed material, a silicone-free epoxy-polysil... -
Resonac Advances Niobium Anode Development for Grid-Scale Energy Storage Systems
PatSnap Eureka Japan Overview Resonac Holdings is pushing forward with the development of advanced niobium-based anode materials for grid-scale energy storage systems. The company's semiconductor and electronic materials division focuses... -
Yousan New Materials Unveils High-Performance Non-Silicone Thermal Interface Pads for AI Chips and Servers
Yousan New Materials China Overview Yousan New Materials has launched a new line of non-silicone thermal interface pads with thermal conductivities ranging from 2.0 to 10.0 W/m·K, specifically engineered for AI chips, servers, and high-p... -
AGC Fluoroproducts Boost Semiconductor and Electronics Performance with High-Temp Release Films and Low-Outgassing Coatings
AGC Chemicals Americas USA Overview AGC's fluoroproducts provide advanced solutions to enhance the performance and reliability of semiconductors and electronics. Fluon® ETFE films offer superior release and cushioning properties at tempe... -
Henkel Expert Reveals Material Innovations Critical for Power Electronics Reliability and Thermal Management
EE Times USA Overview Dr. Bruchak Conley from Henkel discussed the pivotal role of material evolution in power electronics, emphasizing that die attach encapsulants and thermal interface materials (TIMs) dictate module reliability under ...
