New Technology– category –
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Berkeley Lab Leads 13 ‘Genesis Mission AI’ Projects to Accelerate Materials Discovery with AI-Driven Autonomous Labs
Lawrence Berkeley National Laboratory USA Overview Lawrence Berkeley National Laboratory (Berkeley Lab) is leading 13 new 'Genesis Mission AI' projects aimed at accelerating materials discovery through AI-driven autonomous labs. These pr... -
RMIT University Develops High-Efficiency Water Treatment Material for Rapid Microplastic and PFAS Removal
AZoM.com Australia Overview Researchers at RMIT University in Australia have developed an innovative water treatment material capable of rapidly removing invisible microplastics and certain PFAS compounds from water. This new material ac... -
Researchers Achieve Simple Optical Skyrmion Generation in Quantum Materials and Develop Self-Destructing Bioplastics with Engineered Bacteria
ScienceDaily USA Overview Scientists have discovered a remarkably simple method to create exotic optical skyrmions in atomically thin quantum materials, leveraging the 200-year-old Poisson spot phenomenon. Concurrently, new research demo... -
GM Mandates Specialized Adhesives for Corvette C8 Repairs, Signaling Industry Shift in Advanced Material Maintenance
Automobile Repair News USA Overview General Motors has issued a stringent directive requiring specific, validated adhesives for the Corvette C8's rear impact bar replacement, including specialized formulas for aluminum, Sheet Molding Com... -
Intel Seeks Senior Module Test Engineer in Kulim, Malaysia to Advance CUF Module Improvement and New Material Application for Advanced Packaging
Jooble USA Overview Intel is recruiting a Senior Module Test Engineer in Kulim, Malaysia, to lead the design and development of advanced manufacturing test processes. This role supports post-packaging burn-in, final test, and system test... -
AtlasPCB Releases BGA Underfill Selection Guide Comparing Capillary Flow and Reworkable Formulations for Automotive, Aerospace
AtlasPCB Unknown Overview AtlasPCB has published a BGA (Ball Grid Array) underfill selection guide as part of its PCB engineering insights blog series. The article comprehensively compares capillary flow, molded underfills, and reworkabl... -
Lenovo Legion Y70 2026 Gaming Phone Boosts Cooling with 12 W/mK Liquid Metal and High-Conductivity Gel
Cashkr China Overview The Lenovo Legion Y70 2026 gaming phone features a significantly enhanced cooling system, combining a 5,500 mm² vapor chamber with 12 W/mK liquid metal thermal conductivity and high thermal conductive gel. This setu... -
CuspAI Launches ‘AI Materials Foundry’ with Resonac and 45+ Partners to Accelerate Materials Discovery in Semiconductors, Energy, and Climate Change
Morningstar (Business Wire) UK Overview CuspAI has launched the 'AI Materials Foundry,' a global network to accelerate breakthrough materials discovery in semiconductors, energy, and climate change, with Resonac Holdings as a founding me... -
Sheen Technology Publishes Guide for ‘Punchable Silicone-Free Thermal Conductive Material’ for EV & AI Hardware Manufacturing
Sheen Technology Unknown Overview Sheen Technology has released a guide on selecting 'Punchable Silicone-Free Thermal Conductive Material' for high-capacity electronics manufacturing. This material is gaining importance as an alternative... -
3M Dominates Epoxy Structural Adhesive Patents; Multi-Material Bonding for Automotive, Aerospace Lightweighting Remains Key Opportunity
Patsnap USA Overview Patsnap's analysis reveals the epoxy structural adhesive patent landscape is mature, with 3M Innovative Properties Co leading in patent portfolios. Despite increasing demand for multi-material bonding (B32B) in autom...
