New Technology– category –
-
Glass Bubbles Revolutionize Adhesives and Sealants: Delivering Ultra-Lightweight and Enhanced Thermal Performance
Specialty Adhesives & Sealants Blog USA Overview Glass bubble materials are transforming low-density adhesives and sealants by offering exceptional lightweighting, insulation, and processing advantages. These lightweight hollow glass mic... -
Sumitomo Chemical Unveils ‘ELA Series’ High-Purity Alumina for Advanced Semiconductors
AL Circle Japan Overview Sumitomo Chemical has launched the ELA Series, a new range of high-purity alumina products targeting advanced semiconductor manufacturing for AI and high-performance electronics. This series represents the world'... -
Henkel Launches High-Performance Structural Adhesive for Automotive Body-in-White Assembly
Assembtek Germany Overview Henkel has introduced the Teroson EP 52 Series, a new structural adhesive designed for automotive Body-in-White (BIW) production. This heat-curable, solvent-free, one-component adhesive significantly enhances s... -
Camtek’s Precision Inspection and Metrology Solutions Drive Yield and Efficiency in Advanced Packaging
Camtek イスラエル Overview Camtek provides industry-leading 2D and 3D inspection and metrology platforms that address the escalating complexity and rapid growth of the advanced packaging market. Featuring sub-micron defect detection, CAD... -
Rapidus Explores Panel-Level Packaging on Glass Substrates for Next-Gen AI/HPC Processors
Tom's Hardware Japan Overview Japanese semiconductor firm Rapidus is actively exploring the adoption of panel-level packaging (PLP) on large 600mm x 600mm glass panels for manufacturing high-end multi-chiplet processors designed for AI a... -
KLA Enhances AI Chip Production with Comprehensive Wafer Inspection and Metrology for Advanced Packaging
KLA USA Overview KLA offers comprehensive inspection and metrology solutions for complex advanced wafer-level packaging processes, including 2.5D/3D integration, WLCSP, and FOWLP. Its AI-powered systems improve yield, defect detection, a... -
Rapidus to Launch Advanced Packaging Pilot Line in Hokkaido by Spring 2026, Accelerating AI Chip Development
Sic-chip.com (via Digitimes) Japan Overview Japanese semiconductor manufacturer Rapidus is accelerating the development of advanced packaging solutions for AI chips, with plans to commence pilot production at its advanced packaging line ... -
Japan’s Rapidus and LSTC Launch Optoelectronic Advanced Packaging Project to Cut AI Chip Power Consumption
creating nano technologies inc. (via Digitimes) Japan Overview Japan's next-generation semiconductor manufacturer Rapidus, in collaboration with the Leading-edge Semiconductor Technology Center (LSTC) and other institutions, has initiate... -
Glass Substrates Emerge as Next-Generation Solution to AI Chip Packaging Bottleneck
TrendForce Taiwan Overview Glass substrates are gaining significant traction as a next-generation material poised to overcome the limitations of traditional organic substrates and resolve critical bottlenecks in AI chip packaging. Offeri... -
ASE and WUS Announce Strategic Alliance for Advanced AI Packaging Hub in Kaohsiung with NT$35 Billion Investment
ASE Technology Holding Co., Ltd. Taiwan Overview ASE Technology Holding and WUS Printed Circuit have unveiled a strategic collaboration to construct a state-of-the-art manufacturing facility in Kaohsiung, Taiwan, backed by an investment ...
