New Technology– category –
-
Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation to Accelerate Optical Communications Development
Keysight Newsroom USA Overview Keysight Technologies has announced an expansion of its Photonic Design Automation (PDA) portfolio, adding new system-level simulation capabilities. This enhancement allows optical communication system desi... -
International Research Team Develops Ultrafast, Low-Power Chip-Scale Modulators Using Self-Assembled Plasmonic-Organic Hybrid Nanocavities
National Science Review UK Overview An international research team, led by the University of Oxford, has successfully developed an ultrafast, low-power chip-scale modulator utilizing self-assembled plasmonic-organic hybrid nanocavities. ... -
Arista Networks Unveils 1.6T Networking Platforms for AI Fabrics, Doubling Data Center Bandwidth
DCNN Magazine USA Overview Arista Networks has introduced a new portfolio of 1.6T networking platforms designed for AI fabrics, optimized to meet the escalating bandwidth and low-latency requirements of burgeoning AI workloads. Arista em... -
SuperX Debuts 1.6T Optical Modules for AI Data Centers at Interop Tokyo 2026, Setting New High-Speed Connectivity Standards
The Datacenter Engineer USA Overview SuperX unveiled its latest 1.6T optical modules for AI data centers at Interop Tokyo 2026, representing a significant advancement in next-generation data center infrastructure. Designed to meet the ul... -
PhotonCap Explains Characteristics and Data Center Impact of DSP, LPO, NPO, CPO Optical Interconnect Technologies for the AI Era
PhotonCap USA Overview PhotonCap has published an article analyzing DSP, LPO, NPO, and CPO as key optical interconnect technologies driving AI data center evolution. The piece thoroughly compares their advantages and challenges in terms ... -
Tower Semiconductor and Marvell Exceed 5 Million Coherent PIC Shipments for AI Data Centers, Driving High-Performance Connectivity
PIC Magazine USA Overview Tower Semiconductor and Marvell have announced shipping over 5 million coherent Photonic Integrated Circuits (PICs) for AI data centers. This milestone underscores their success in delivering high-speed, low-pow... -
Schubert Group Unveils AI-Powered Platform for Rapid Polymer Discovery at AI4X 2026
不明 Germany Overview At the AI4X Conference 2026 in Singapore, the Schubert Group presented groundbreaking advancements in AI-driven polymer research, demonstrating a significant acceleration in the discovery of new functional macromate... -
Purdue University Seeks Postdoctoral Researchers in Computational Materials Design and Materials Informatics, Bolstering DFT and MLIPs Research
ApplyKite USA Overview Purdue University has announced a postdoctoral researcher opening in computational materials design and materials informatics. This strategic hire targets researchers with strong expertise in atomistic simulation m... -
AtomGPT.org Launches Open-Access Agentic AI Platform ‘AGAPI-Agents’ to Accelerate Materials Design
The Journal of Physical Chemistry Letters USA Overview AtomGPT.org has launched 'AGAPI-Agents,' an open-access agentic AI platform integrating open-source Large Language Models (LLMs) with scientific tools and databases for accelerated m... -
Tokyo Institute of Science Achieves Sub-Millisecond AI for Semiconductor Inverse Problems
東京科学大学 Japan Overview Scientists at the Tokyo Institute of Science have developed a tandem neural network that solves complex semiconductor inverse problems in under one millisecond. This AI system infers critical material paramete...
