New Technology– category –
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Z-Polymers Unveils Ultra-Fine ‘Tullomer Fiber’ Offering Over 4x PEEK Strength and Superior Thermal Stability for Advanced Manufacturing
Plastics Technology USA Overview Boston-based Z-Polymers has introduced 'Tullomer fiber,' touted as the thinnest functional monofilament fiber in the U.S. This innovative fiber boasts over four times the mechanical strength of PEEK and e... -
Chinese Academy of Sciences Develops Self-Compensated Flexible Sensor for Simultaneous Gesture Recognition and Temperature Perception
Chinese Academy of Sciences (CAS) China Overview Researchers at the Chinese Academy of Sciences' Institute of Metal Research have developed an innovative flexible, dual-function, self-compensated sensor capable of simultaneous gesture re... -
3D-Printed High-Entropy Alloy Achieves Unprecedented 1.3 GPa Yield Strength and 14% Ductility, Surpassing Titanium Alloys
Department of Energy USA Overview Researchers at the U.S. Department of Energy have significantly enhanced the strength and ductility of 3D-printed high-entropy alloys (HEAs) using a novel laser-based additive manufacturing process. The ... -
Indium Corporation Unveils AuLTRA® 75 Gold-Based Die-Attach Preforms for 5G, Military, and Aerospace GaN Devices at IMS
Industrial Electronics USA Overview Indium Corporation announced it will feature its high-reliability, gold-based precision die-attach preforms at the International Microwave Symposium (IMS). A highlight is AuLTRA® 75, an off-eutectic Au... -
Chase Corporation Acquires Sheldahl from Flex, Strengthening High-Reliability Material Portfolio for Aerospace and Medical Applications
Chase Corporation USA Overview Chase Corporation announced the acquisition of Sheldahl from Flex, significantly expanding its engineered materials portfolio. Sheldahl specializes in designing and manufacturing coated films, laminates, an... -
AI Theme Propels Nikkei 225, Driving Significant Gains for Advanced Packaging Material Companies like Resonac and Mitsui Kinzoku
IG Japan Overview The latest Nikkei 225 analysis highlights the significant impact of the AI theme on the market, showing substantial gains for chemical manufacturers like Resonac, a global leader in advanced packaging materials and epox... -
ECTC 2026: Intel Foundry and Amkor Announce Advanced Packaging Technologies for AI/HPC and U.S. Manufacturing Capacity Expansion
Intel Newsroom, Amkor Technology Blog, Semiconductor Engineering USA Overview The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased advanced packaging technologies redefining scalability limits for AI and high-pe... -
pH- and Cellulase-Triggered Bio-Based Adhesive Facilitates Pharmaceutical Blister Pack Recycling
RSC Publishing (Green Chemistry) Unknown Overview Researchers have developed a biodegradable, bio-based adhesive to aid in the recycling of pharmaceutical blister packaging. Composed of cellulose nanocrystals, chitosan, and a bifunctiona... -
German President Visits INM to Witness ‘Living Materials’ and Recyclable Wood Using Bacteria-Derived Bio-Based Adhesives
Leibniz-INM Germany Overview German Federal President Frank-Walter Steinmeier visited INM – Leibniz Institute for New Materials to observe research into "living materials." A highlight was the demonstration of fully recyclable, sustainab... -
Dutch NWO Funds Bio-Based Fast Debonding Adhesives to Halve Composite Repair Times for Aerospace Applications with Ministry of Defense Support
NWO (Netherlands Organisation for Scientific Research) Netherlands Overview The Netherlands Organisation for Scientific Research (NWO), with support from the Ministry of Defense, has launched ten research projects, including the developm...
