New Technology– category –
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New Review Highlights Environmentally Friendly Starch-Based Adhesives for High-Performance Wood Composites
ResearchGate (Journal: Polymers) Unknown Overview A new review paper has been published on the use of environmentally friendly starch-based adhesives for bonding high-performance wood composites. This research evaluates the potential of ... -
Mastering 3D-IC Verification Complexity: Multiphysics Analysis Key to Addressing Thermal, Mechanical Stress, and Reliability Challenges
Semiconductor Engineering USA Overview As the semiconductor industry transitions from 2D to 2.5D and 3D-IC configurations, verification complexity is escalating significantly. This article emphasizes the necessity of multiphysics analysi... -
Samsung Electronics Leads Advanced Packaging with Projected Triple HBM Sales and Thinnest 0.65mm LPDDR DRAM Package Development
Simply Wall St South Korea Overview Samsung Electronics is leading advanced packaging advancements by leveraging extensive in-house expertise to streamline production cycles and reduce lead times. The company projects its High Bandwidth ... -
Comprehensive Review of SiC Power Module Packaging: Silver and Copper Sintering Key to Enhanced Thermal and Electrical Performance
IEEE Xplore Unknown Overview A comprehensive review paper analyzes the latest technologies in SiC power module packaging, focusing on layout, material systems, and integration. The review emphasizes how advanced die-attach techniques, in... -
PCIM Europe 2026 Unveils Innovations in Power Module Reliability and SiC/GaN Power Semiconductor Packaging Technologies
MacDermid Alpha, PCIM Europe Germany Overview PCIM Europe 2026 in Nuremberg, Germany, featured significant innovations in power module reliability and next-generation power semiconductor packaging. MacDermid Alpha unveiled underfills, hi... -
High-Performance Bio-Based Natural Rubber Latex Adhesives Reinforced by Grafting-Coordination Hybrid Networks Developed
ACS Sustainable Chemistry & Engineering Unknown Overview An academic paper details the development of high-performance bio-based adhesives with robust interfacial adhesion and environmental durability, crucial for sustainable composite m... -
Scanning Acoustic Microscopy (SAM) Enables High-Precision Non-Destructive Detection of Internal Defects in Semiconductor Packaging
Infinita Lab USA Overview Scanning Acoustic Microscopy (SAM) is highlighted as a critical non-destructive tool for high-precision evaluation of internal defects in semiconductors, electronic packaging, and material science. SAM excels at... -
Plasma Surface Engineering for Automotive Thermal Management Maximizes TIM Wettability to Minimize Thermal Resistance
KeyLink USA Overview Advanced plasma surface treatment has been introduced to significantly reduce contact thermal resistance in EV powertrain cooling systems. This technology elevates substrate surface energy to over 72 mN/m, achieving ... -
Canadian Space Agency Awards $2M for Lunar In-Situ Resource Utilization (ISRU) Studies: Advancing Self-Sufficiency and Nuclear Power for Moon Bases
SpaceQ Canada Overview The Canadian Space Agency (CSA) has awarded a total of $2 million across four new research contracts for Lunar In-Situ Resource Utilization (ISRU) to explore methods for human survival on the Moon. Canadian Strateg... -
University of Florida Innovates Lunar Construction with Laser ‘Origami’ Technology: 3D Printing Tools and Structures from In-Situ Resources
Universe Today USA Overview Researchers at the University of Florida are exploring innovative methods for constructing structures on the Moon using laser-forming technology, dubbed 'laser origami.' This non-contact process precisely bend...
