New Technology– category –
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SemiMedia Reports China Accelerating Global Catch-Up in Advanced Packaging Materials for AI and HPC
SemiMedia China Overview A SemiMedia report indicates that China is accelerating its global catch-up in advanced packaging materials, driven by the demand for AI chips and high-performance computing (HPC). The focus is on developing high... -
T-Global Technology Launches TG-AD30D, a Low-Outgassing Thermal Pad with 3.0 W/m·K Conductivity for High-Reliability Electronics
T-Global Technology Taiwan Overview T-Global Technology has introduced the TG-AD30D, an advanced low-outgassing thermal pad designed for high-reliability electronics and sensitive environments. This hybrid thermal pad offers 3.0 W/m·K th... -
PatSnap Eureka Report: Optimizing Adhesive Coverage to Reduce Cell Delamination Risks in Advanced Packaging and Flexible Displays
PatSnap Eureka Global Overview A PatSnap Eureka report highlights the critical need for improved adhesive technologies and optimized coverage to prevent cell delamination in advanced semiconductor packaging and flexible display sectors. ... -
QinanX New Material Offers Fast-Curing, High-Clarity, Low-Shrinkage UV-Curable Adhesives for Electronics, Optics, and Medical Industries
QinanX New Material China Overview QinanX New Material provides UV-curable adhesives that cure in seconds under UV light for a wide range of applications, including electronics, optical lenses, displays, medical devices, and glass/plasti... -
Arkema Unveils Next-Gen Material Solutions for EV Batteries at Battery Show Europe 2026, Enhancing Adhesion, Energy Density, and Recyclability
Arkema France Overview Arkema showcased integrated material solutions for EV and energy storage system battery packs at The Battery Show Europe 2026, focusing on improved adhesion, energy density, safety, and recyclability. Key innovatio... -
PatSnap Eureka Report: Advanced Adhesive Formulations Critical for Preventing Thermal Runaway in EV and Energy Storage Systems
PatSnap Eureka Global Overview A new PatSnap Eureka report highlights the essential role of advanced adhesive formulations in preventing or mitigating thermal runaway in energy storage systems. Research focuses on developing materials wi... -
Dow Launches DOWSIL TC-3120 Thermal Gel with 12 W/m·K Conductivity for AI Networking and 800G/1.6T Optical Modules
Lightwave USA Overview Dow has introduced DOWSIL TC-3120 Thermal Gel, a new silicone-based thermal interface material (TIM) designed for high-speed networking equipment, optical modules, and other electronics facing intense thermal-manag... -
Tasger Industries Unveils “Lunar Capsule” Concept to Promote Resource Transport and Colonization via Lunar Habitats, Research Facilities, and Logistics Hubs
Access Newswire (Tasger Industries) USA Overview Tasger Industries has announced its "Lunar Capsule" concept, a modular system designed to function as lunar habitats, research facilities, or logistics hubs. A primary objective is to faci... -
Resolve Optics Delivers Radiation-Resistant Lenses with 1 MGy Tolerance for LEO Small Satellite Camera Cores
SatNews UK Overview Resolve Optics has shipped its initial batch of flight-ready radiation-hardened optical lenses for small satellite camera cores targeting Low Earth Orbit (LEO). Manufactured using premium cerium-doped glass, these len... -
UAH and NASA Partner to Advance Nuclear Thermal Propulsion, Shortening Mars Transit Time to Make Deep Space Exploration a Reality
The University of Alabama in Huntsville USA Overview The University of Alabama in Huntsville (UAH) has partnered with NASA Marshall Space Flight Center (MSFC) to advance Nuclear Thermal Propulsion (NTP) systems, a crucial technology for ...
