May 2026– date –
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PicoQuant Introduces Solira: A Novel Time-Resolved Photoluminescence Microscope for Advanced Materials Characterization
Spectroscopy Online Germany Overview PicoQuant has launched Solira, a new modular upright microscope designed for time-resolved photoluminescence (TRPL) and comprehensive materials characterization. Solira supports a wide range of advanc... -
Tescan’s Orage™ 2 Ga+ FIB-SEM Redefines Automated TEM Sample Preparation
AZoM チェコ Overview Tescan has launched Orage™ 2, a next-generation Ga+ FIB-SEM column integrated into its AMBER 2 platform, designed to revolutionize TEM sample preparation and nanoscale characterization in advanced materials science. ... -
Samsung and Intel Pioneer Low-Warpage Solutions for Advanced Electronics Packaging, Boosting Reliability
PatSnap Eureka Global Overview Samsung and Intel are spearheading efforts to reduce warpage in electronics packaging components. Samsung leverages its I-Cube technology and optimized package stack designs to match thermal expansion chara... -
Advanced Spray Adhesives Reshape Industrial Manufacturing with Focus on Sustainability and High Performance
SNS Insider Global Overview The spray adhesive market is projected to grow, driven by demands from construction, automotive, and packaging industries for high-performance bonding solutions. Huntsman, a key supplier of specialty chemicals... -
Techinno Redefines AI Thermal Management with 16W/m·K Silicone-Free Gap Pad
Techinno (泰吉诺) China Overview Techinno has launched 'Fill-Pad US 1600,' an advanced silicone-free thermal gap pad specifically designed to combat the severe thermal challenges in high-density AI data centers. Featuring an industry-lea... -
Kingfa Advances Low-Stress Crystallization Techniques for Mold Compounds, Mitigating Warpage in Advanced Packaging
Global Semiconductor Global Overview Advanced mold compounds face challenges like package warpage, delamination, and mechanical property degradation due to inherent stresses during crystallization. Kingfa adopts advanced nucleation syste... -
Yousan New Materials Unveils Non-Silicone Thermal Interface Pads (2-10W/m·K) for AI Chips and High-Power Electronics
Yousan New Materials China Overview Yousan New Materials has introduced a new range of non-silicone thermal interface pads with thermal conductivities from 2.0 to 10.0 W/m·K, targeting AI chips, servers, and automotive electronics. These... -
Low-Stress Mold Compounds Evolve to Protect Fragile Components in Advanced Semiconductor Packages
Global Semiconductor Global Overview Modern low-stress molding technologies encompass diverse material compositions, including silicone-based compounds and modified epoxies with flexible segments. These compounds have evolved to address ... -
Dymax to Showcase Latest UV/LED-Curable Adhesives and Technologies for Battery and Electronics Manufacturing at The Battery Show Europe 2026
PresseBox Germany Overview Dymax is set to showcase its newest UV/LED-curable materials and technological innovations for battery and electronics manufacturing at The Battery Show Europe 2026. Highlights include new solutions for camera ... -
EU Battery Regulation Highlights Failure Risks of Self-Adhesive Labels for EV and Industrial Batteries
Pryor Marking Technology UK Overview This article discusses the limitations of self-adhesive labels for EV and industrial batteries under the new EU Battery Regulation, which mandates indelible marking. It explains that adhesive bonds we...
